IP Library Granted Patent US 7,695,286
Granted Patent B2
US 7,695,286 · App. 12/204,741 · Granted Apr 13, 2010

Semiconductor electromechanical contact

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Quick Facts
Patent No.
US 7,695,286
App. No.
12/204,741
Granted
Apr 13, 2010
Kind
B2
Abstract

A compliant electrical contact assembly for interconnecting a lead or terminal of an integrated circuit having two cantilever beams positioned within a slot in a housing arranged such that a portion of the beams slide along a portion of one another and within the housing as the beams are deformed elastically in order to allow more travel and compliance without yielding or totally deforming the beam. The sliding action during deformation effectively multiplies the total compliance in the assembly above and beyond the compliance otherwise available to elastic compression of the cantilever beams.

Claims (20)

1. An electromechanical contact assembly comprising:

a housing having at least one slot; and

two cantilever beam contact elements positioned within the slot which elastically deform under compression by a portion of the contact elements sliding along one another and within sidewalls of the slot non-normally to a direction of deformation thus multiplying an effective compliance of the assembly so that it is larger than an actual deformation of the contact elements, and each of the cantilever beam contact elements having a contact tip sliding against a sidewall of the slot and extending out of the slot horizontally spaced from one another.

2. The assembly of claim 1 wherein each contact element is a beam having an acute bend to form a first sliding surface and a second sliding surface wherein the first sliding surface of a first beam is adjacent a first sliding surface of a second beam.

3. The assembly of claim 1 wherein the two contact elements are contained within a conductive cage positioned within the slot of the housing.

4. The assembly of claim 1 wherein the two contact elements contain a slot for positioning the contact elements on a conductive plate within the slot.

5. The assembly of claim 1 wherein the contact elements are a beam having multiple sections separated by acute bends.

6. The assembly of claim 1 wherein the two contact elements are configured to be aligned within the slot in the housing.

7. The assembly of claim 1 wherein the two contact elements are configured to be offset within the slot in the housing.

8. The assembly of claim 1 wherein the two contact elements extend from the slot in the housing at an angle.

9. A test socket for an integrated circuit package comprising:

a housing have a plurality of slots, each slot having opposite sidewalls;

a first contact element having a contact tip and a second contact element having a contact tip positioned within the slot sliding against a sidewall of the slot wherein each contact element is a cantilever beam having at least two sections formed by an acute angle bend and the contact tip of the first contact element extends out of the slot and is horizontally spaced from the contact tip of the second contact element which extends out of an opposite side of the slot; and

a load board having test pad locations for one of the first contact element or the second contact element such that during compression of the first contact element and the second contact element each of the first contact element and the second contact element slide upon one another and along the sidewalls of the slot.

10. The test socket of claim 9 wherein each of the first contact element and the second contact element has a first sliding surface and a second sliding surface wherein the first sliding surfaces are adjacent to one another and the second sliding surfaces are adjacent opposite sidewalls.

11. The test socket of claim 9 wherein the first contact element and the second contact element are contained within a conductive cage positioned within each slot of the housing.

12. The test socket of claim 9 wherein the first contact element and the second contact element are positioned on a conductive plate within each slot in the housing.

13. The test socket of claim 9 wherein the first contact element and the second contact element have multiple sections separated by acute bends.

14. The test socket of claim 9 wherein the first contact element and the second contact element is a cantilever beam having a rectangular cross-section.

15. The test socket of claim 9 wherein the first contact element and the second contact element are a cantilever beam having a circular cross-section.

Assignments (10)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624 Recorded Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: XCERRA CORPORATION
Reel/Frame 066762/0811 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Nov 28, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047675/0354 →
PATENT SECURITY AGREEMENT Recorded Oct 2, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047185/0624 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 7261561 AND REPLACE WITH PATENT NUMBER 7231561 PREVIOUSLY RECORDED ON REEL 034660 FRAME 0188. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT. Recorded Feb 11, 2016
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 037824/0372 →
RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS Recorded Dec 18, 2014
From: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
To: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
Reel/Frame 034660/0394 →
SECURITY AGREEMENT Recorded Dec 18, 2014
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 034660/0188 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2014
From: DELAWARE CAPITAL FORMATION, INC.
To: LTX-CREDENCE CORPORATION
Reel/Frame 033091/0639 →
CHANGE OF NAME Recorded May 27, 2014
From: LTX-CREDENCE CORPORATION
To: XCERRA CORPORATION
Reel/Frame 033032/0768 →
SECURITY AGREEMENT Recorded Jan 17, 2014
From: LTX-CREDENCE CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 032086/0476 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2008
From: SWART, MARK; ELLIS, JOHN
To: DELAWARE CAPITAL FORMATION, INC.
Reel/Frame 021493/0963 →