Semiconductor device manufacturing method and semiconductor device

1. A semiconductor device manufacturing method, comprising:

a first step of forming a first electrode of a capacitor on a semiconductor substrate;

a second step of forming a capacitor insulating film on the whole surface including a side surface and an upper surface of the first electrode;

a third step of forming a protection insulating film made of a material different from that of the capacitor insulating film, on the capacitor insulating film;

a fourth step of removing the protection insulating film and the capacitor insulating film from the upper surface of the first electrode, by anisotropically etching the protection insulating film and the capacitor insulating film;

a fifth step of removing the protection insulating film that remains on the side surface of the first electrode; and

a sixth step of forming a second electrode of the capacitor on the capacitor insulating film, after removing the protection insulating film.

2. The semiconductor device manufacturing method as claimed in claim 1 , wherein

at the first step, a cap insulating film of the same pattern as that of the first electrode is formed on the first electrode, and

at the end of the anisotropic etching at the fourth step, the anisotropic etching is controlled so that the capacitor insulating film covers at least a part of the side surface of the cap insulating film.

3. The semiconductor device manufacturing method as claimed in claim 2 , wherein

the first electrode is a plate electrode, and the second electrode is a storage electrode.

4. The semiconductor device manufacturing method as claimed in claim 3 , wherein

the first step comprises:

a first sub step of forming a first electrode material on the semiconductor substrate; and

a second sub step of forming the plate electrode by patterning the first electrode material.

5. The semiconductor device manufacturing method as claimed in claim 4 , wherein

by the patterning at the second sub step, through-holes are formed in the plate electrode,

at the fourth step, the laminated film of the capacitor insulating film and the protection insulating film is left on the inner side surface of the through-holes, and bottom portions of the through-holes are exposed, and

at the sixth step, a second electrode material is filled in the through-holes to form the storage electrode.

6. The semiconductor device manufacturing method as claimed in claim 1 , wherein

the first electrode is a plate electrode, and the second electrode is a storage electrode.

7. The semiconductor device manufacturing method as claimed in claim 6 , wherein

the first step comprises:

a first sub step of forming a first electrode material on the semiconductor substrate; and

a second sub step of forming the plate electrode by patterning the first electrode material.

8. The semiconductor device manufacturing method as claimed in claim 7 , wherein

by the patterning at the second sub step, through-holes are formed in the plate electrode,

at the fourth step, the laminated film of the capacitor insulating film and the protection insulating film is left on the inner side surface of the through-holes, and bottom portions of the through-holes are exposed, and

at the sixth step, a second electrode material is filled in the through-holes to form the storage electrode.

9. The semiconductor device manufacturing method as claimed in claim 8 , wherein

the capacitor includes a plurality of laminated capacitor layers, each of the laminated capacitor layers has the first electrode, the capacitor insulating film and the second electrode, and the first electrode and the second electrode of each of the laminated capacitor layers are electrically connected to each other, respectively.

10. The semiconductor device manufacturing method as claimed in claim 7 , wherein

the capacitor includes a plurality of laminated capacitor layers, each of the laminated capacitor layers has the first electrode, the capacitor insulating film and the second electrode, and the first electrode and the second electrode of each of the laminated capacitor layers are electrically connected to each other, respectively.

11. The semiconductor device manufacturing method as claimed in claim 10 , wherein

the protection insulating film is a silicon oxide film.

12. The semiconductor device manufacturing method as claimed in claim 1 , wherein

the capacitor includes a plurality of laminated capacitor layers, each of the laminated capacitor layers has the first electrode, the capacitor insulating film and the second electrode, and the first electrode and the second electrode of each of the laminated capacitor layers are electrically connected to each other, respectively.

13. The semiconductor device manufacturing method as claimed in claim 1 , wherein

the capacitor insulating film is any one of a tantalum oxide film, an aluminum oxide film, an hafnium oxide film, and a laminated film including one of an aluminum oxide film and an hafnium oxide film.

14. The semiconductor device manufacturing method as claimed in claim 1 , wherein

the protection insulating film is a silicon oxide film.

15. A semiconductor device manufacturing method, comprising:

a first step of forming a first electrode of a capacitor on a semiconductor substrate;

a second step of forming a capacitor insulating film on the whole surface including a side surface and an upper surface of the first electrode;

a third step of forming a protection insulating film made of a material different from that of the capacitor insulating film, on the capacitor insulating film;

a fourth step of removing the protection insulating film and the capacitor insulating film which are formed on the upper surface of the first electrode;

a fifth step of removing the protection insulating film that remains on the side surface of the first electrode; and

a sixth step of forming a second electrode of the capacitor on the capacitor insulating film.

16. The semiconductor device manufacturing method as claimed in claim 15 , wherein at the fourth step, the protection insulating film and the capacitor insulating film are removed by anisotropically etching, and at the fifth step, the protection insulating film is removed by wet etching.

17. The semiconductor device manufacturing method as claimed in claim 16 , wherein at the first step, through-holes are formed in the first electrode by patterning the first electrode, at the fourth step, the laminated film of the capacitor insulating film and the protection insulating film is left on the inner side surface of the through-holes, and bottom portions of the through-holes are exposed, and at the sixth step, a second electrode material is filled in the through-holes.

18. The semiconductor device manufacturing method as claimed in claim 17 , wherein the capacitor includes a plurality of laminated capacitor layers, each of the laminated capacitor layers has the first electrode, the capacitor insulating film and the second electrode, and the first electrode and the second electrode of each of the laminated capacitor layers are electrically connected to each other, respectively.

19. The semiconductor device manufacturing method as claimed in claim 15 , wherein at the first step, through-holes are formed in the first electrode by pattering the first electrode, at the fourth step, the laminated film of the capacitor insulating film and the protection insulating film is left on the inner side surface of the through-holes, and bottom portions of the through-holes are exposed, and at the sixth step, a second electrode material is filled in the through-holes.