IP Library Granted Patent US 8,266,095
Granted Patent B2
US 8,266,095 · App. 12/225,390 · Granted Sep 11, 2012

Substrate processing system and operation inspecting method

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Quick Facts
Patent No.
US 8,266,095
App. No.
12/225,390
Granted
Sep 11, 2012
Kind
B2
Abstract

There is provided a substrate processing system that can automatically inspect the operation of various kinds of parts of a semiconductor manufacturing apparatus without increasing the load of a main controller in the semiconductor manufacturing apparatus. In the substrate processing system of the present invention, inspection data of the semiconductor manufacturing apparatus 1 under operation are shared and collected online by a main controller 5 , a data collection auxiliary computer 2 and a data collecting computer 3 through a network 6 , and the operation state is collectively inspected by an inspecting computer 4.

Claims (34)

1. A substrate processing system comprising at least one substrate processing apparatus to execute a desired processing on a substrate, a data collecting device that collects data from the substrate processing apparatus and comprising a storage unit for storing the collected data, and an inspecting device to inspect data accumulated in the storage unit, the inspecting device comprising:

a search specifying unit that searches the data accumulated in the storage unit for data within a predetermined period;

an upper and lower limit specifying unit that specifies an upper limit value and a lower limit value of a time;

a data obtaining unit that obtains data from the storage unit; and

a judging unit that judges whether the obtained data is within a range specified by the upper and lower limit specifying unit,

wherein, when a preset state is finished at a time of obtaining the data within the predetermined period, the data obtaining unit further obtains the data within a predetermined definite period of time to go back to a past time from a time of head data of the obtained data, and

wherein the judging unit judges whether the data obtained by the data obtaining unit is within the range between the upper and the lower limit values specified by the upper and lower limit value specifying unit.

2. The substrate processing system according to claim 1 , wherein the data obtained by the data obtaining unit comprises event data indicating a change of a state, and

wherein the judging unit judges whether the event data indicates the preset state, and inspects a duration of the preset state by comparing the duration with the upper and lower limit values at an end time of the event data.

3. An operation inspecting method for inspecting data by using an inspecting device, the inspecting device comprising:

a search specifying unit that searches data accumulated in a storage unit for data within a predetermined period, the accumulated data being collected from at least one substrate processing apparatus configured to conduct a desired processing on a substrate;

an upper and lower limit specifying unit that specifies an upper limit value and a lower limit value of a time;

a data obtaining unit that obtains data from the storage unit; and

a judging unit that judges whether the obtained data is within a range specified by the upper and lower limit specifying unit,

wherein the method comprises

judging, by the judging unit, whether the obtained data is within a range between the upper limit value and the lower limit value specified by the upper and lower limit value specifying unit, and

wherein, when a preset state is finished at a time of obtaining the data within the predetermined period, the data obtaining unit further obtains the data within a predetermined definite period of time to go back to a past time from a time of head data of the obtained data.

4. The substrate processing system according to claim 1 , wherein the collected data comprises event data indicating a change of a preset state, and

wherein the judging unit judges whether an end time of the event data is within the range between the upper and lower limit values.

5. An inspecting device to inspect data which is collected from at least one substrate processing apparatus to execute a desired processing on a substrate and is accumulated in a storage unit, the inspecting device comprising:

a search specifying unit that searches the data accumulated in the storage unit for data within a predetermined period;

an upper and lower limit specifying unit that specifies an upper limit value and a lower limit value of a time;

a data obtaining unit that obtains data from the storage unit based on the search; and

a judging unit that judges whether the obtained data is within a range specified by the upper and lower limit specifying unit,

wherein, when a preset state is finished at a time of obtaining the data within the predetermined period, the data obtaining unit further obtains the data within a predetermined definite period of time to go back to a past time from a time of head data of the obtained data, and

wherein the judging unit judges whether the obtained data is within the range between the upper and lower limit values specified by the upper and lower limit value specifying unit.

6. The inspecting device according to claim 5 , wherein the collected data comprises event data indicating a change of a preset state, and

wherein the judging unit judges whether an end time of the event data is within the range between the upper and lower limit values.

7. The inspecting device according to claim 5 , wherein the data obtained by the data obtaining unit comprises event data indicating a change of a state, and

wherein the judging unit judges whether the event data indicates the preset state, and inspects a duration of the preset state by comparing the duration with the upper and lower limit values at an end time of the event data.

8. The operation inspecting method according to claim 3 , wherein the collected data comprises event data indicating a change of a preset state, and

wherein the judging unit judges whether an end time of the event data is within the range between the upper and lower limit values.

9. The operation inspecting method according to claim 3 , wherein the data obtained by the data obtaining unit comprises event data indicating a change of a state, and

wherein the judging unit judges whether the event data indicates the preset state, and inspects duration of the preset state by comparing the duration with the upper and lower limit values at an end time of the event data.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2008
From: YAMAGUCHI, HIDETO; JOHO, YASUHIRO; MATSUDA, MITSUHIRO; KOYAMA, YOSHITAKA
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 021870/0941 →