IP Library Granted Patent US 7,953,512
Granted Patent B2
US 7,953,512 · App. 12/230,788 · Granted May 31, 2011

Substrate processing system, control method for substrate processing apparatus and program stored on medium

Assignee: Tokyo Electron Limitetd
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Quick Facts
Patent No.
US 7,953,512
App. No.
12/230,788
Granted
May 31, 2011
Kind
B2
Abstract

The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve effective control for a film-forming amount on processed substrates. The substrate processing system includes a substrate processing unit adapted for forming a film on each of the plurality of substrates; a pattern obtaining unit adapted for obtaining information about an arrangement pattern concerning arrangement of unprocessed substrates and processed substrates among the plurality of substrates; and a memory unit adapted for storing therein an arrangement/film-forming-amount model indicative of influence exerted on the film-forming amount on the substrates by the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates. A calculation unit calculates an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on the arrangement/film-forming-amount model. Then, a determination unit determines whether or not the estimated film-forming amount calculated by the calculation unit is within a predetermined range. If the estimated film-forming amount calculated by the calculation unit is determined to be within the predetermined range, a control unit will control and drive the substrate processing unit to process the substrates.

Claims (29)

1. A substrate processing system, comprising:

a substrate processing unit which is adapted for storing therein a plurality of substrates including unprocessed substrates and processed substrates respectively arranged in a multistage fashion as well as adapted for providing a heating process and a gas supplying process to the plurality of substrates, so as to form a film on each of the plurality of substrates;

a pattern obtaining unit adapted for obtaining information about an arrangement pattern concerning arrangement of the unprocessed substrates and processed substrates among the plurality of the substrates;

a first memory unit adapted for storing therein an arrangement/film-forming-amount model indicative of influence exerted on a film-forming amount on the substrates by the arrangement pattern concerning the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates;

a calculation unit adapted for calculating an estimated film-forming amount on the substrates, in the case of the arrangement pattern obtained by the pattern obtaining unit, based on the arrangement/film-forming-amount model stored in the first memory unit;

a determination unit adapted for determining whether or not the estimated film-forming amount calculated by the calculation unit is within a predetermined range; and

a control unit adapted for controlling and driving the substrate processing unit to process the substrates when the estimated film-forming amount calculated by the calculation unit is determined to be within the predetermined range.

2. The substrate processing system according to claim 1 ,

wherein the calculation unit further calculates the estimated film-forming amount on a plurality of monitor substrates included in the plurality of substrates, and

wherein the determination unit further determines whether or not the estimated film-forming amount and uniformity thereof on each of the plurality of monitor substrates are within predetermined ranges, respectively.

3. The substrate processing system according to claim 1 , further comprising:

a second memory unit adapted for storing therein a temperature/film-forming-amount model indicative of influence exerted on the film-forming amount on the substrates by a processing temperature for the substrates; and

a temperature determination unit adapted for determining the processing temperature, based on the temperature/film-forming-amount model stored in the second memory unit, when the estimated film-forming amount calculated by the calculation unit is determined to be out of the predetermined range;

wherein the control unit controls the substrate processing unit, based on the processing temperature determined by the temperature determination unit.

4. The substrate processing system according to claim 3 ,

wherein the substrate processing unit includes a plurality of heating units each adapted for heating the substrates, and

wherein the temperature determination unit determines a processing temperature corresponding to each of the plurality of heating units, based on the temperature/film-forming-amount model stored in the second memory unit, when uniformity of the estimated film-forming amount calculated by the calculation unit is determined to be out of predetermined range.

5. A control method for controlling a substrate processing apparatus which is adapted for storing therein a plurality of substrates including unprocessed substrates and processed substrates respectively arranged in multistage fashion as well as adapted for providing a heating process and a gas supplying process to the plurality of substrates, so as to form a film on each of the plurality of substrates, the method comprising the steps of:

obtaining information about an arrangement pattern concerning arrangement of the unprocessed substrates and processed substrates among the plurality of substrates;

calculating an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on an arrangement/film-forming-amount model indicative of influence exerted on a film-forming amount on the substrates by the arrangement pattern concerning the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates;

determining whether or not the estimated film-forming amount calculated in the calculating step is within a predetermined range; and

controlling the substrate processing apparatus when the estimated film-forming amount calculated in the calculating step is determined to be within the predetermined range.

6. A non-transitory storage medium storing therein a computer program configured for driving a computer to perform a control method for a substrate processing apparatus,

wherein the method is configured for controlling the substrate processing apparatus which is adapted for storing therein a plurality of substrates including unprocessed substrates and processed substrates respectively arranged in a multistage fashion as well as adapted for providing a heating process and a gas supplying process to the plurality of substrates, so as to form a film on each of the plurality of substrates, and

wherein the method comprises steps of:

obtaining information about an arrangement pattern concerning arrangement of the unprocessed substrates and processed substrates among the plurality of substrates;

calculating an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on an arrangement/film-forming-amount model indicative of influence exerted on a film-forming amount on the substrates by the arrangement pattern concerning the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates;

determining whether or not the estimated film-forming amount calculated in the calculating step is within a predetermined range; and

controlling the substrate processing apparatus when the estimated film-forming amount calculated in the calculating step is determined to be within the predetermined range.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2008
From: TAKENAGA, YUICHI; YAMAGUCHI, TATSUYA; WANG, WENLING; TAKAHASHI, TOSHIHIKO; YONEZAWA, MASATO
To: TOKYO ELECTRON LIMITED
Reel/Frame 021532/0973 →
Priority Claims (1)
JP 2007-249054 · Sep 26, 2007 · national
Continuity (1)
Related Publication 20090078197A1 · Mar 26, 2009