Circuit device
View Patent ↗The present invention provides a circuit device in which warpage of a case member is prevented. The circuit device of the present invention includes: a circuit board having on an upper surface thereof a built-in hybrid integrated circuit constituted by a conductive pattern and a circuit element; a case member including four side wall parts forming a frame-like shape and being in contact with the circuit board so as to form on the upper surface of the circuit board a space in which the circuit element is sealed; and a lead being fixed to a pad composed of the conductive pattern and extending to the outside. The circuit device of the present invention is further provided with a supporting part arranged at a corner of the case member so as to make continuous inner walls of the respective side wall parts with each other.
1. A circuit device, comprising:
a circuit board having on an upper surface thereof a built-in hybrid integrated circuit constituted by a conductive pattern and a circuit element;
a case member including four side wall parts forming a frame-like shape and in contact with the circuit board so as to form on the upper surface of the circuit board a space in which the circuit element is sealed;
a sealing resin to coat the conductive pattern and the circuit element on the upper surface of the circuit board and to fill in the space;
a lead fixed to a pad composed of the conductive pattern and extending to the outside of the sealing resin; and
a supporting part arranged at a corner of the case member so as to make continuous inner walls of the respective side wall parts with each other,
wherein a lower surface of the supporting part is attached to the upper surface of the circuit board and the supporting part is covered by the sealing resin.
2. The circuit device according to claim 1 , wherein
an uneven region in which the circuit board is to be housed is formed by partially hollowing inner sides of the respective side wall parts,
a principal surface of the supporting part is located in the same plane as the uneven region, and
the case member is fixed to the circuit board via an adhesive applied to the uneven region and the supporting part.
3. The circuit device according to claim 1 , wherein
cross-sectional areas of the side wall parts are formed to be identical with each other, and
a cross-sectional area of the supporting part is smaller than the cross-sectional area of each side wall part.
4. The circuit device according to claim 1 , wherein the supporting part is provided to each of the four corners of the case member.
5. The circuit device according to claim 1 , further comprising
an inner side wall surrounding a region in which the circuit board is to be fixed by a screw, while continuing with the inner wall of the side wall part, wherein
the inner wall of the side wall part and the inner side wall are made continuous with each other by the supporting part.
6. The circuit device according to claim 1 , wherein a thickness of a lower part of the side wall part contacting a side surface of the circuit board is thinner than an upper part of the side wall.
7. The circuit device according to claim 1 , wherein the lower surface of the supporting part is attached to the upper surface of the circuit board by an adhesive.
8. The circuit device according to claim 1 , wherein a bottom surface of the supporting part is attached to a top surface of the circuit board.