Circuit device and method of manufacturing the same
View Patent ↗Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.
1. A circuit device, comprising:
a case member;
a first circuit board incorporated into the case member, the first circuit board having a first conductive pattern formed on a surface thereof;
a second circuit board arranged over the first circuit board and incorporated into the case member, the second circuit board having a second conductive pattern formed on a surface thereof;
a first circuit element mounted on the first circuit board and electrically connected to the first conductive pattern;
a second circuit element mounted on the second circuit board and electrically connected to the second conductive pattern; and
a lead structure secured to the first circuit board or the second circuit board,
wherein the lead structure includes a first lead connected to the first circuit element, not connected to the second circuit element and penetrating through the second circuit board and a second lead connected to both the first circuit element mounted on the first circuit board and the second circuit element mounted on the second circuit board.
2. The circuit device according to claim 1 , wherein the lead structure further includes a third lead connected to the second circuit element and not connected to the first circuit element.
3. The circuit device according to claim 2 , further comprising a sealing resin which is disposed on an upper face of the second circuit board so as to cover the second circuit element, wherein end portions of the first lead and the third lead penetrate through the sealing resin so that the end portions protrude from the sealing resin, and an end portion of the second lead is positioned inside the sealing resin.
4. The circuit device according to claim 2 , wherein the first circuit element mounted on the first circuit board includes a power transistor, the second circuit element mounted on the second circuit board includes a controlling element which generates a control signal for controlling the power transistor, and the control signal is supplied to the power transistor via the second lead.
5. The circuit device according to claim 1 , wherein the first lead penetrates through an opening in the case member.
6. A circuit device, comprising:
a case member;
a first circuit board incorporated into the case member, the first circuit board having a first conductive pattern formed on a surface thereof;
a second circuit board arranged over the first circuit board and incorporated into the case member, the second circuit board having a second conductive pattern formed on a surface thereof;
a first circuit element mounted on the first circuit board and electrically connected to the first conductive pattern;
a second circuit element mounted on the second circuit board and electrically connected to the second conductive pattern;
a sealing resin which is disposed on the surface of the second circuit board so as to seal the second circuit element; and
a lead structure including a first lead having one end connected to the first conductive pattern on the surface of the first circuit board and having another end passing through a first through-hole provided in the second circuit board so as to protrude from the sealing resin, the lead structure further including a second lead penetrating through a second through-hole provided in the second circuit board and electrically connected to the second circuit element mounted on an upper face of the second circuit board, and the first lead not being electrically connected to the second circuit element mounted on the second circuit board;
a first bonding agent filling a gap between the first lead and the first through-hole of the second circuit board and
a second bonding agent filling a gap between the second lead and the second through-hole.
7. The circuit device according to claim 6 , wherein the first bonding agent and the second bonding agent are a solder.
8. The circuit device according to claim 6 , further comprising a pad connected to the second conductive pattern provided in the periphery of the through-hole of the second circuit board.