Method of forming a semiconductor package including two devices
View Patent ↗A method of forming a semiconductor package includes providing a carrier, attaching a first surface of a first device on the carrier, wherein the first surface comprises a first active surface of the first device, and attaching a second surface of a second device on the carrier. In one embodiment, the second surface is opposite a third surface of the second semiconductor die and the third surface comprises a second active surface. A first insulating material can be formed between the first device and the second device.
1. A method comprising:
providing a carrier;
providing a first device having a first major surface and a second major surface, the first major surface comprising an active surface including a sensor, an active display, or a microelectromechanical device;
providing a second device having a first major surface and a second major surface, the first major surface comprising an active surface;
attaching the first major surface of the first device to the carrier;
attaching the second major surface of the second device to the carrier, the first major surface of the first device coplanar with the second major surface of the second device;
forming a first through-via extending from the second major surface of the first device towards the first major surface of the first device and electrically coupled to circuitry of the active surface of the first device;
forming a first insulating material between minor surfaces of the first device and the second device;
forming a second insulating material over the entirety of the first device and the second device;
forming a first via in the second insulating material, the first via electrically coupled to the first through-via;
forming a second via in the second insulating material, the second via electrically coupled to circuitry at the active surface of the second device;
electrically coupling a first terminal to the first via;
electrically coupling a second terminal to the second via; and
removing at least a portion of the carrier to expose at least a portion of the active surface of the first device.
2. The method of claim 1 , wherein removing comprises etching.
3. The method of claim 1 , where removing comprises using light or heat.
4. The method of claim 1 , wherein removing occurs after electrically coupling the first terminal to the first via.
5. The method of claim 1 , wherein the carrier is selected from a group consisting of: glass and tape.
6. The method of claim 1 , wherein the first terminal and the second terminal comprise solder balls.
7. The method of claim 1 , wherein in a finished semiconductor package, the active surface of the second device is not exposed.
8. The method of claim 1 , wherein the first insulating material is in direct contact with the first and second devices.
9. The method of claim 1 , further comprising:
forming a second through-via extending from the second major surface of the first device towards the first major surface of the first device and electrically coupled to circuitry of the active surface of the first device;
forming a third via in the second insulating material, the third via electrically coupled to the second through-via;
forming a fourth via in the second insulating material, the fourth via electrically coupled to circuitry at the active surface of the second device; and
electrically coupling the third and fourth vias to each other.
10. A method comprising:
providing a carrier;
providing a first device having a first major surface and a second major surface, the first major surface comprising an active surface including a sensor, an active display, or a microelectromechanical device;
providing a second device having a first major surface and a second major surface, the first major surface comprising an active surface;
attaching the first major surface of the first device to the carrier;
attaching the second major surface of the second device to the carrier, the first major surface of the first device coplanar with the second major surface of the second device;
forming a sacrificial layer over the active surface of the second device to protect the active surface during a subsequent processing step;
forming a first insulating material between minor surfaces of the first device and the second device;
forming a second insulating material over the entirety of the first device and the second device;
forming a first via in the second insulating material, the first via electrically coupled to a contact at the second major surface of the first device, the contact electrically coupled to circuitry at the active surface of the first device by a first through-via extending from the second major surface of the first device towards the first major surface of the first device, the first through via formed at the first device prior to attaching the first device to the carrier;
forming a second via in the insulating material, the second via electrically coupled to circuitry at the active surface of the second device;
electrically coupling a first terminal to the first via;
electrically coupling a second terminal to the second via; and
removing at least a portion of the carrier to expose at least a portion of the active surface of the first device.
11. The method of claim 10 , wherein
the active surface of the second device is not exposed.
12. The method of claim 10 , further comprising disposing a lens adjacent and optically coupled to the active surface of the first device.
13. The method of claim 10 , wherein the first insulating material is in direct contact with the first and second devices.
14. The method of claim 10 , wherein the first device is of a different type as compared to the second device.
15. The method of claim 10 , further comprising:
forming a third via in the second insulating material, the third via electrically coupled to circuitry at the active surface of the first device by a second through-via; and
forming a fourth via in the insulating material, the fourth via electrically coupled to circuitry at the active surface of the second device, wherein the third via is electrically coupled to the fourth via.
16. The method of claim 10 , wherein the entire carrier is removed.
17. The method of claim 10 , wherein the portion of the carrier that is removed is removed by etching.
18. The method of claim 10 , wherein the portion of the carrier that is removed is removed using light or heat.
19. The method of claim 10 , wherein the portion of the carrier that is removed is removed after electrically coupling the first terminal to the first via.
20. The method of claim 10 , wherein the carrier is selected from a group consisting of: glass and tape.
21. The method of claim 10 , wherein the first terminal and the second terminal comprise solder balls.