IP Library Granted Patent US 7,788,565
Granted Patent B2
US 7,788,565 · App. 12/246,873 · Granted Aug 31, 2010

Semiconductor integrated circuit

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Quick Facts
Patent No.
US 7,788,565
App. No.
12/246,873
Granted
Aug 31, 2010
Kind
B2
Abstract

A semiconductor integrated circuit having a low maximum allowable operating frequency such as an analog circuit can be prevented from being destroyed during a scan test. When a scan test mode signal is “1”, output signals of a first AND circuit and a second AND circuit are fixed to a low level and an output of an OR circuit is fixed to a high level. Therefore, output signals of fourth through sixth flip-flops FF 4 -FF 6 are not transferred to first through third analog circuits during the scan test. On the other hand, the output signals of the fourth through sixth flip-flops FF 4 -FF 6 are transferred to the first through third analog circuits during a normal operation.

Claims (21)

1. A semiconductor integrated circuit comprising:

a first circuit comprising a plurality of logic circuits;

a plurality of flip-flops each provided for a corresponding logic circuit;

a plurality of selectors connecting the flip-flops to the first circuit in a normal operation, the selectors being configured to connect the flip-flops in a chain formation so that the flip-flops make a shift register during a scan test;

a second circuit having a maximum allowable operating frequency lower than a maximum operating frequency of the shift register during the scan test; and

a gate circuit that receives an output of one of the flip-flops and controls a transfer of the output so that the output is transferred to the second circuit during the normal operation and the output is not transferred to the second circuit during the scan test.

2. The semiconductor integrated circuit of claim 1 , wherein an output of the gate circuit is fixed to a predetermined level during the scan test.

3. The semiconductor integrated circuit of claim 2 , wherein the first circuit comprises a digital circuit, and the second circuit comprises an analog circuit.

4. The semiconductor integrated circuit of claim 3 , wherein the second circuit comprises a level shift circuit.

5. The semiconductor integrated circuit of claim 4 , wherein the first circuit comprises a combinational logic circuit.

6. The semiconductor integrated circuit of claim 3 , wherein the first circuit comprises a combinational logic circuit.

7. The semiconductor integrated circuit of claim 2 , wherein the second circuit comprises a level shift circuit.

8. The semiconductor integrated circuit of claim 7 , wherein the first circuit comprises a combinational logic circuit.

9. The semiconductor integrated circuit of claim 2 , wherein the first circuit comprises a combinational logic circuit.

10. The semiconductor integrated circuit of claim 1 , wherein the first circuit comprises a digital circuit, and the second circuit comprises an analog circuit.

11. The semiconductor integrated circuit of claim 10 , wherein the second circuit comprises a level shift circuit.

12. The semiconductor integrated circuit of claim 11 , wherein the first circuit comprises a combinational logic circuit.

13. The semiconductor integrated circuit of claim 10 , wherein the first circuit comprises a combinational logic circuit.

14. The semiconductor integrated circuit of claim 1 , wherein the second circuit comprises a level shift circuit.

15. The semiconductor integrated circuit of claim 14 , wherein the first circuit comprises a combinational logic circuit.

16. The semiconductor integrated circuit of claim 1 , wherein the first circuit comprises a combinational logic circuit.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 033813 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 21, 2015
From: SYSTEM SOLUTIONS CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034816/0510 →
CHANGE OF NAME Recorded Dec 3, 2014
From: SANYO SEMICONDUCTOR CO., LTD
To: SYSTEM SOLUTIONS CO., LTD.
Reel/Frame 034537/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033813/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT #12/577882 PREVIOUSLY RECORDED ON REEL 026594 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2011
From: SANYO ELECTRIC CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 026594/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2009
From: NISHIYAMA, TAKAKO; ITO, HIDEO
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 022063/0915 →