Detection circuit and foreign matter inspection apparatus for semiconductor wafer
View Patent ↗In a foreign matter inspection apparatus for a semiconductor wafer, a PMT which detects reflection light, an amplifier which amplifies a signal detected by the PMT and in which response characteristics of amplification are controlled by a control signal, an A/D converter which converts the signal amplified by the amplifier into a predetermined code and outputs the code, a control circuit which generates a control signal based on information of the semiconductor wafer having a correlation with the reflection light, and a data processing circuit which detects a foreign matter on the semiconductor wafer based on the code output from the A/D converter are provided.
1. A foreign matter inspection apparatus for a semiconductor wafer comprising:
a reflection light detector which irradiates a semiconductor wafer, which is an object to be inspected, with irradiation light and detects reflection light from the semiconductor wafer;
an amplifier which amplifies a signal based on the reflection light detected by the reflection light detector and in which response characteristics of amplification are controlled by using a control signal including radius information of the semiconductor wafer having a correlation with the reflection light and a relation between a detection circuit gain and a frequency determined in accordance with a radius position of the semiconductor wafer;
an A/D converter which converts the signal amplified by the amplifier into a predetermined code and outputs the code;
a control circuit which generates the control signal based on information of the semiconductor wafer having a correlation with the reflection light; and
a data processing circuit which detects a foreign matter on the semiconductor wafer based on the code output from the A/D converter.
2. The foreign matter inspection apparatus for semiconductor wafer according to claim 1 , wherein the amplifier controls the response characteristics of the amplification by using the control signal and the relation between the detection circuit gain and the frequency in which the frequency and the detection circuit gain are decreased when being closer to an inner circumference of the semiconductor wafer and the frequency and the detection circuit gain are increased when being closer to an outer circumference.
3. A foreign matter inspection apparatus for a semiconductor wafer comprising:
a reflection light detector which irradiates a semiconductor wafer, which is an object to be inspected, with irradiation light and detects reflection light from the semiconductor wafer;
an amplifier which amplifies a signal detected by the reflection light detector;
an A/D converter which converts the signal amplified by the amplifier into a predetermined code and outputs the code;
an operational circuit which variably controls the code output from the A/D converter by using a control signal having a correlation with the reflection light and a relation between a detection circuit gain and a frequency determined in accordance with a radius position of the semiconductor wafer;
a control circuit which generates the control signal based on information of the semiconductor wafer having a correlation with the reflection light; and
a data processing circuit which detects a foreign matter on the semiconductor wafer based on the code which has been subjected to the arithmetic operation in the operational circuit.
4. The foreign matter inspection apparatus for a semiconductor wafer according to claim 3 , wherein the operational circuit variably controls the code by using the control signal and the relation between the detection circuit gain and the frequency in which the frequency and the detection circuit gain are decreased when being closer to an inner circumference of the semiconductor wafer and the frequency and the detection circuit gain are increased when being closer to an outer circumference.
5. A foreign matter inspection apparatus for a semiconductor wafer comprising:
a reflection light detector which irradiates a semiconductor wafer, which is an object to be inspected, with irradiation light and detects reflection light from the semiconductor wafer;
an amplifier which amplifies a signal detected by the reflection light detector;
an A/D converter which converts the signal amplified by the amplifier into a predetermined code and outputs the code;
a control circuit which generates a control signal including radius information of the semiconductor wafer having a correlation with the reflection light; and
a data processing circuit which detects a foreign matter of the semiconductor wafer based on the code output from the A/D converter and the control signal and a relation between a detection circuit gain and a frequency determined in accordance with a radius position of the semiconductor wafer.
6. The foreign matter inspection apparatus for a semiconductor wafer according to claim 5 , wherein the data processing circuit detects the foreign matter of the semiconductor wafer by using the code, the control signal in which the frequency and the detection circuit gain are decreased when being closer to an inner circumference of the semiconductor wafer and the frequency and the detection circuit gain are increased when being closer to an outer circumference, and the relation between the detection circuit gain and the frequency determined in accordance with the radius position of the semiconductor wafer.