IP Library Granted Patent US 8,026,523
Granted Patent B2
US 8,026,523 · App. 12/285,799 · Granted Sep 27, 2011

Nitride semiconductor free-standing substrate and device using the same

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Quick Facts
Patent No.
US 8,026,523
App. No.
12/285,799
Granted
Sep 27, 2011
Kind
B2
Abstract

A nitride semiconductor free-standing substrate includes a surface inclined in a range of 0.03° to 1.0° from a C-plane, and an off-orientation that an angle defined between a C-axis and a tangent at each point on a whole surface of the substrate becomes maximum is displaced in a range of 0.5° to 16° from a particular M-axis orientation of six-fold symmetry M-axis orientations. The substrate does not include a region of −0.5°<φ<+0.5° on the surface, where φ represents a displacement angle of the off-orientation on a surface of the substrate from the particular M-axis orientation.

Claims (20)

1. A nitride semiconductor free-standing substrate, comprising:

a surface inclined in a range of 0.03° to 1.0° from a C-plane,

wherein an off-orientation that an angle defined between a C-axis and a tangent at each point on a whole surface of the substrate becomes maximum is displaced in a range of 0.5° to 16° from a particular M-axis orientation of six-fold symmetry M-axis orientations, and

wherein the substrate does not include a region of −0.5°<φ<+0.5° on the surface, where φ represents a displacement angle of the off-orientation from the particular M-axis orientation.

2. The nitride semiconductor free-standing substrate according to claim 1 , wherein the off-orientation is displaced in a range of 1° to 13° from the particular M-axis orientation.

3. The nitride semiconductor free-standing substrate according to claim 1 , wherein the off orientation is displaced in a range of 2° to 8° from the particular M-axis orientation.

4. A nitride semiconductor light-emitting device, comprising:

a light emitting layer comprising a nitride semiconductor on the nitride semiconductor free-standing substrate device according to claim 1 .

5. The light-emitting device according to claim 4 , wherein the light emitting layer comprises InGaN.

6. The light-emitting device according to claim 4 , wherein the light emitting device comprises a light emitting diode.

7. The light-emitting device according to claim 4 , wherein the light-emitting device comprises a laser device.

8. The light-emitting device according to claim 7 , wherein an oscillation threshold current is between 20 mA and 30 mA.

9. A nitride semiconductor electronic device, comprising;

an electronic device layer comprising a nitride semiconductor on the nitride semiconductor free-standing substrate device according to claim 1 .

10. The nitride semiconductor free-standing substrate according to claim 1 , wherein said surface comprises a GaN surface.

11. The nitride semiconductor free-standing substrate according to claim 1 , wherein the surface comprises a polished surface.

12. The nitride semiconductor free-standing substrate according to claim 1 , wherein first steps, on a surface of a crystal grown on the substrate, normal to the M-axis orientation and second steps, on the surface of the crystal grown on the substrate, normal to the A-axis orientation have a zigzag shape microscopically.

13. The nitride semiconductor free-standing substrate according to claim 1 , wherein an emission half-value width of photoluminescence at a central position of the substrate is 30 nm or less.

14. The nitride semiconductor free-standing substrate according to claim 1 , wherein an emission half-value width of photoluminescence at a central position of the substrate is 10 nm or less.

15. The nitride semiconductor free-standing substrate according to claim 1 , wherein a current falling rate is about half of a current falling rate when the off-orientation is directed to the particular M-axis orientation.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →
COMPANY SPLIT Recorded Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
MERGER AND CHANGE OF NAME Recorded Dec 15, 2014
From: HITACHI CABLE, LTD.; HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034630/0897 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2009
From: FUJIKURA, HAJIME
To: HITACHI CABLE, LTD.
Reel/Frame 022094/0463 →