Immersion flow field maintenance system for an immersion lithography machine
View Patent ↗An immersion flow field maintenance system for an immersion lithography machine. The machine includes a projection objective lens, a wafer stage for supporting the wafer, and an immersion supplying system distributed around the lens for producing an immersion flow field under the lens. The system includes a horizontal guideway, a flat board connected with the horizontal guideway through a cantilever, and drivers for moving the board. When the wafer is unloading and the wafer stage is moving out of the exposure area under the lens, the board connects to and moves synchronously with the wafer stage to transfer the flow field from above the wafer stage to above the board. When the wafer is loaded and the wafer stage is moving into the exposure area, the board connects to and moves synchronously with the wafer stage to transfer the flow field from above the board to above the wafer stage.
1. An immersion flow field maintenance system for an immersion lithography machine, the lithography machine including a projection objective lens, at least a wafer stage for supporting a wafer, and an immersion supplying system distributed around the projection objective lens for producing an immersion flow field under the projection objective lens, characterized in that
the immersion maintenance system includes a horizontal guideway, a flat board connected with the horizontal guideway through a cantilever, and plural drivers for driving the flat board to move;
when the wafer is unloading and the wafer stage is moving out of the exposure area under the projection objective lens, the flat board connects to and moves synchronously with the wafer stage to transfer the immersion flow field from above the wafer stage to above the flat board;
when the wafer is loaded and the wafer stage is moving into the exposure area, the flat board connects to and moves synchronously with the wafer stage to transfer the immersion flow field from above the flat board to above the wafer stage; and
when the lithography machine carries out exposure, the flat board is moved to the periphery of the projection objective lens driven by horizontal drivers and is raised over the wafer stage driven by vertical drivers without interfering with the movement of the wafer stage carrying out exposure.
2. The immersion flow field maintenance system according to claim 1 , further characterized in that, the immersion flow field can be established on the flat board without supporting by the wafer stage.
3. The immersion flow field maintenance system according to claim 1 , further characterized in that, the drivers include horizontal drivers attached to the horizontal guideway and driving the flat board to move in the horizontal direction, and vertical drivers attached to the cantilever and driving the flat board to move in the vertical direction.
4. The immersion flow field maintenance system according to claim 1 , further characterized in that, the flat board has a hydrophobic surface the same as the surface of the wafer.
5. The immersion flow field maintenance system according to claim 1 , further characterized in that, the flat board can be connected to the wafer stage via waterproof connectors.
6. The immersion flow field maintenance system according to claim 1 , further characterized in that, a clamping device is disposed on the edge of the wafer stage for clamping the wafer stage and the flat board after they are connected with each other.
7. The immersion flow field maintenance system according to claim 1 , further characterized in that, the horizontal guideway includes two parallel linear bearings, and the cantilever includes plural symmetrically positioned vertical cantilevers extended from opposite sides of the flat board, cantilevers of each side being connected to the horizontal guideway of the corresponding side.
8. The immersion flow field maintenance system according to claim 1 , further characterized in that, the lithography machine includes one or more wafer stages, the immersion flow field switching between each wafer stage and the flat board, wherein, the direction of one wafer stage entering the immersion flow field is the same as the direction of the other wafer stage leaving the immersion flow field.
9. The immersion flow field maintenance system according to claim 8 , further characterized in that, waterproof connectors are provided on both edges of the flat board and the two wafer stages.