Test board used for a reliability test and reliability test method
To conduct a reliability test for a tape automated bonding (TAB) package under a state being close to a mounting state to a product, the TAB package ( 1 ) includes a TAB tape ( 3 ), a semiconductor chip ( 2 ) mounted on the TAB tape ( 3 ), and a first terminal ( 7 a ) and a second terminal ( 7 b ) formed on both end portions of the TAB tape ( 3 ), electrically connected to the semiconductor chip ( 2 ) through wiring. A test board ( 10 ) used for the reliability test for the TAB package ( 1 ) includes a substrate ( 20 ), a pair of holding members ( 30 - 1, 30 - 2 ) provided on the substrate 20 so as to face with each other for holding the respective both end portions of the TAB package ( 1 ), holding portion terminals each provided to each of the pair of holding members ( 30 - 1, 30 - 2 ) so as to have a contact with each of the first terminal ( 7 a ) and the second terminal ( 7 b ). A distance (L 2 ) between the pair of holding members ( 30 - 1, 30 - 2 ) is shorter than a distance (L 1 ) between the first terminal ( 7 a ) and the second terminal ( 7 b ) along a surface of the TAB package ( 1 ).
1 . A test board, which is used for a reliability test for a tape automated bonding (TAB) package comprising: a tape automated bonding (TAB) tape; a semiconductor chip mounted on the TAB tape; and a first terminal and a second terminal formed on both end portions of the TAB tape, respectively and electrically connected to the semiconductor chip through wiring,
the test board comprising:
a substrate;
a pair of holding members provided on the substrate so as to face with each other, for holding the respective both end portions of the TAB package; and
holding portion terminals each provided to each of the pair of holding members so as to have a contact with each of the first terminal and the second terminal,
wherein a distance between the pair of holding members is shorter than a distance between the first terminal and the second terminal along a surface of the TAB package.
2 . A test board according to claim 1 , wherein, when at a time of the reliability test, the pair of holding members holds the both end portions so that the TAB package bends along a direction from the first terminal toward the second terminal.
3 . A test board according to claim 1 , wherein, when at the time of the reliability test, power is supplied to the semiconductor chip through the holding portion terminals, and the first terminal and the second terminal.
4 . A test board according to claims 1 ,
wherein each of the pair of holding members comprises: a fixing portion fixed on the substrate; and a movable portion fixed to the fixing portion, and
wherein the fixing portion and the movable portion are formed so as to sandwich the TAB package.
5 . A test board according to claims 1 , wherein the TAB package is mounted on a display device.
6 . A test board, which is used for a reliability test for a tape automated bonding (TAB) package comprising: a tape automated bonding (TAB) tape; a semiconductor chip mounted on the TAB tape; and a first terminal and a second terminal formed on both end portions of the TAB tape, respectively and electrically connected to the semiconductor chip through wiring,
the test board comprising:
a substrate;
a pair of holding members provided on the substrate so as to face with each other, for holding the respective both end portions of the TAB package; and
holding portion terminals each provided to each of the pair of holding members so as to have a contact with each of the first terminal and the second terminal,
wherein, when at a time of the reliability test, the pair of holding members holds the both end portions so that the TAB package bends in a direction from the first terminal toward the second terminal.
7 . A reliability test method for a tape automated bonding (TAB) package comprising: a tape automated bonding (TAB) tape; a semiconductor chip mounted on the TAB tape; and a first terminal and a second terminal formed on both end portions of the TAB tape, respectively and electrically connected to the semiconductor chip through wiring, the method comprising the steps of:
fixing the both end portions of the TAB package to a test board so that the TAB package bends along a direction from the first terminal toward the second terminal; and
conducting a reliability test while supplying power to the semiconductor chip through the first terminal and the second terminal.