IP Library Granted Patent US 7,863,649
Granted Patent B2
US 7,863,649 · App. 12/331,668 · Granted Jan 4, 2011

Nitride semiconductor device and method for fabricating the same

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Quick Facts
Patent No.
US 7,863,649
App. No.
12/331,668
Granted
Jan 4, 2011
Kind
B2
Abstract

A nitride semiconductor device includes: first through third nitride semiconductor layers formed in sequence over a substrate. The second nitride semiconductor layer has a band gap energy larger than that of the first nitride semiconductor layer. The third nitride semiconductor layer has an opening. A p-type fourth nitride semiconductor layer is formed so that the opening is filled therewith. A gate electrode is formed on the fourth nitride semiconductor layer.

Claims (22)

1. A nitride semiconductor device, comprising:

a substrate;

a first nitride semiconductor layer formed on the substrate;

a second nitride semiconductor layer formed on the first nitride semiconductor layer and having a band gap energy larger than that of the first nitride semiconductor layer;

a third nitride semiconductor layer formed on the second nitride semiconductor layer and having an opening;

a p-type fourth nitride semiconductor layer filling the opening; and

a gate electrode formed on the fourth nitride semiconductor layer.

2. The nitride semiconductor device of claim 1 , wherein the third nitride semiconductor layer is of an n-type.

3. The nitride semiconductor device of claim 1 , further including a fifth nitride semiconductor layer formed between the second nitride semiconductor layer and the fourth nitride semiconductor layer.

4. The nitride semiconductor device of claim 3 , wherein a difference in lattice constant between the second nitride semiconductor layer and the fifth nitride semiconductor layer is smaller than that between the second nitride semiconductor layer and the fourth nitride semiconductor layer.

5. The nitride semiconductor device of claim 1 , further including a sixth nitride semiconductor layer formed between the second nitride semiconductor layer and the third nitride semiconductor layer.

6. The nitride semiconductor device of claim 5 , wherein the sixth nitride semiconductor layer is of a p-type.

7. The nitride semiconductor device of claim 6 , wherein a difference in lattice constant between the sixth nitride semiconductor layer and the fourth nitride semiconductor layer is smaller than that between the second nitride semiconductor layer and the fourth nitride semiconductor layer.

8. The nitride semiconductor device of claim 6 , wherein the sixth nitride semiconductor layer has a band gap energy larger than that of the fourth nitride semiconductor layer.

9. The nitride semiconductor device of claim 8 , further including a fifth nitride semiconductor layer formed between the sixth nitride semiconductor layer and the fourth nitride semiconductor layer.

10. The nitride semiconductor device of claim 9 , wherein a difference in lattice constant between the sixth nitride semiconductor layer and the fifth nitride semiconductor layer is smaller than that between the sixth nitride semiconductor layer and the fourth nitride semiconductor layer.

11. The nitride semiconductor device of claim 5 , wherein the sixth nitride semiconductor layer includes a first p-type layer and a second p-type layer formed on the first p-type layer.

12. The nitride semiconductor device of claim 11 , wherein the first p-type layer has a band gap energy larger than that of the second p-type layer, and

a difference in lattice constant between the second p-type layer and the fourth nitride semiconductor layer is smaller than that between the first p-type layer and the fourth nitride semiconductor layer.

13. The nitride semiconductor device of claim 5 , wherein the sixth nitride semiconductor layer is of an n-type.

14. The nitride semiconductor device of claim 13 , wherein the sixth nitride semiconductor layer has a band gap energy smaller than that of the third nitride semiconductor layer.

15. The nitride semiconductor device of claim 1 , wherein the nitride semiconductor device is of a normally-off type.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2025
From: INFINEON TECHNOLOGIES AUSTRIA AG
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 072853/0508 →
CHANGE OF NAME Recorded Dec 13, 2024
From: PANASONIC CORPORATION
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 069631/0392 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2009
From: HIKITA, MASAHIRO; UEDA, TETSUZO
To: PANASONIC CORPORATION
Reel/Frame 022154/0607 →