Mesa semiconductor device and method of manufacturing the same
View Patent ↗The invention provides a mesa semiconductor device and a method of manufacturing the same which minimize the manufacturing cost and prevents contamination and physical damage of the device. An N− type semiconductor layer is formed on a front surface of a semiconductor substrate, and a P type semiconductor layer is formed thereon. An anode electrode is further formed on the P type semiconductor layer so as to be connected to the P type semiconductor layer, and a mesa groove is formed from the front surface of the P type semiconductor layer deeper than the N− type semiconductor layer so as to surround the anode electrode. Then, a second insulation film is formed from inside the mesa groove onto the end portion of the anode electrode. The second insulation film is made of an organic insulator such as polyimide type resin or the like. The lamination body made of the semiconductor substrate and the layers laminated thereon is then diced along a scribe line.
1. A mesa semiconductor device comprising:
a semiconductor substrate comprising a first semiconductor layer of a first general conductive type and a second semiconductor layer of a second general conductive type formed on a front surface of the first semiconductor layer so as to have a PN junction between the first and second semiconductor layers;
a first insulation film covering a front surface of the second semiconductor layer and having an opening;
an electrode formed on the front surface of the second semiconductor layer so as to be in contact with the second semiconductor layer through the opening of the first insulation film;
a mesa groove formed in the semiconductor substrate from the front surface of the second semiconductor layer to define a mesa on top of which the electrode is disposed; and
a second insulation film filling the mesa groove and extending onto the front surface of the second semiconductor layer so as to cover the first insulation film and an end portion of the electrode.
2. The mesa semiconductor device of claim 1 , wherein the second insulation film comprises an organic insulator.
3. The mesa semiconductor device of claim 2 , wherein the organic insulator comprises a polyimide or an epoxy resin.
4. The mesa semiconductor device of claim 1 , wherein the mesa groove extends beyond the PN junction to reach the first semiconductor layer.
5. The mesa semiconductor device of claim 1 , wherein the first semiconductor layer comprises a first layer and a second layer formed on a front surface of the first layer and having a lower concentration than the first layer, and the second layer is in contact with the second semiconductor layer.
6. The mesa semiconductor device of claim 5 , wherein the mesa groove extends beyond the PN junction to reach the first layer of the first semiconductor layer.