IP Library Granted Patent US 7,833,825
Granted Patent B2
US 7,833,825 · App. 12/355,189 · Granted Nov 16, 2010

Solution-based deposition process for metal chalcogenides

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Quick Facts
Patent No.
US 7,833,825
App. No.
12/355,189
Granted
Nov 16, 2010
Kind
B2
Abstract

A solution of a hydrazine-based precursor of a metal chalcogenide is prepared by adding an elemental metal and an elemental chalcogen to a hydrazine compound. The precursor solution can be used to form a film. The precursor solutions can be used in preparing field-effect transistors, photovoltaic devices and phase-change memory devices.

Claims (22)

1. A method of preparing an improved field-effect transistor of the type having a source region and a drain region, a channel layer extending between the source region and the drain region, the channel layer including a semiconducting material, a gate region, disposed in spaced adjacency to the channel layer, an electrically insulating layer between the gate region and the source region, drain region and channel layer, wherein the method comprises:

preparing a channel layer comprising a film of a metal chalcogenide semiconducting material which comprises preparing a solution of a precursor of a metal chalcogenide by adding an elemental metal and an elemental chalcogen to a hydrazine compound to provide a solution of said precursor of the metal chalcogenide;

applying a solution of said precursor onto a substrate to produce a film of said precursor; and annealing the film of the precursor to produce the metal chalcogenide film on said substrate; wherein the annealing is carried out at a temperature of about 150 to about 350° C.

2. The method of claim 1 wherein the concentration of the metal chalcogenide precursor in the hydrazine compound is no more than about 10 molar.

3. The method of claim 1 wherein the concentration of the metal chalcogenide precursor in the hydrazine compound is about 0.01 molar to about 10 molar.

4. The method of claim 1 wherein the concentration of the metal chalcogenide precursor in the hydrazine compound is about 0.05 to about 1 molar.

5. The method of claim 1 wherein the hydrazine compound is represented by the formula;

R 1 R 2 N—NR 3 R 4

wherein each of R 1 , R 2 , R 3 and R 4 is independently hydrogen, aryl, a linear or branched alkyl having 1-6 carbon atoms or a cyclic alkyl of 3-6 carbon atoms.

6. The method of claim 1 wherein the hydrazine compound comprises hydrazine.

7. The method of claim 1 wherein said hydrazine compound is anhydrous.

8. The method of claim 1 wherein said metal chalcogenide comprises a member selected from the group consisting of KSb 5 S 8 , SnS 2 , and Ga 2 Se 3 .

9. The method of claim 1 wherein said elemental metal, elemental chalcogen and hydrazine compound are stirred at temperatures of about 5 C to about 95 C.

10. A field-effect transistor prepared by the method of claim 1 .

11. A method of preparing a photovoltaic device which comprises preparing a film by depositing a film of a metal chalcogenide which comprises preparing a solution of a hydrazine-based precursor of a metal chalcogenide which comprises adding an elemental metal and an elemental chalcogen to a hydrazine compound to provide a solution of said precursor of the metal chalcogenide; applying a solution of said precursor onto a substrate to produce a film of said precursor; and annealing the film of the precursor to produce the metal chalcogenide film on the substrate.

12. The method of claim 11 wherein the annealing is carried out at temperatures of about 100 to about 500° C.

13. The method of claim 11 wherein the annealing is carried out at temperatures of about 150 to about 350° C.

14. A photovoltaic device prepared by the method of claim 11 .

15. A method of preparing a phase-change memory device which comprises preparing a layer by depositing a layer of a metal chalcogenide which comprises preparing a solution of a hydrazine-based precursor of a metal chalcogenide which comprises adding an elemental metal and an elemental chalcogen to a hydrazine compound to provide a solution of said precursor of the metal chalcogenide; applying a solution of said precursor onto a substrate to produce a film of said precursor; and annealing the film of the precursor to produce a metal chalcogenide layer on the substrate.

16. The method of claim 15 wherein the annealing is carried out at temperatures of about 100 to about 500° C.

17. The method of claim 15 wherein the annealing is carried out at temperatures of about 150 to about 350° C.

18. A phase-change memory device prepared by the method of claim 15 .

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
SECURITY AGREEMENT Recorded Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 037766/0371 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2016
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 037591/0225 →