Low cost fingerprint sensor system
View Patent ↗Low cost fingerprint system having a single chip solution includes a circuit board, a fingerprint sensor array fabricated onto a first surface of the circuit board, and an integrated circuit die for processing information received from the fingerprint sensor array is mounted directly to a second surface of the circuit board. The integrated circuit die may be electrically connected to the sensor by, for example, vias in the circuit board.
1. A fingerprint sensor system comprising:
a circuit board including a first surface and a second surface;
a fingerprint sensor array fabricated onto the first surface, wherein the fingerprint sensor array comprises a specific pattern of metal traces etched on the first surface of the circuit board, wherein the specific pattern comprises a plurality of metal lines having varying lengths and pitches;
an integrated circuit die for processing information received from the fingerprint sensor is mounted to the second surface and electrically coupled to the fingerprint sensor array.
2. The system as recited in claim 1 , wherein the circuit board further includes a plurality of electrical contacts fabricated onto one of the top surface or bottom surface, wherein the plurality of electrical contacts are coupled to the integrated circuit via a plurality of signal traces.
3. The system as recited in claim 2 , further comprising a flexible strip including a plurality of signal traces mated directly to the plurality of electrical contacts of the circuit board without a connector, thereby forming a connectorless electrical mating between the flexible strip and the electrical contacts.
4. The system as recited in claim 3 , wherein the flexible strip is mechanically secured to the circuit board by a screw that is used to secure the circuit board to another device.
5. The system as recited in claim 1 , wherein the integrated circuit die is directly mounted and electrically bonded to the circuit board without having an integrated circuit package assembly.
6. The system as recited in claim 5 , wherein the integrated circuit die is electrically bonded to the circuit board using electrical signal bonding wires that are bonded directly from bond pads on the integrated circuit die to contact pads formed on the circuit board.
7. The system as recited in claim 1 , wherein the fingerprint sensor array comprises a capacitive the fingerprint sensor array.
8. The system as recited in claim 1 , wherein the integrated circuit die is mounted to the second surface of the circuit board at a location directly opposite and in alignment with the fingerprint sensor array location on the first surface of the circuit board.
9. A mobile device comprising:
a housing;
a motherboard mounted within the housing;
a fingerprint sensor system mounted to the housing and coupled to the motherboard, wherein the fingerprint sensor system includes:
a circuit board including a first surface and a second surface;
a fingerprint sensor array fabricated onto the first surface, wherein the fingerprint sensor array comprises a specific pattern of metal traces etched on the first surface of the circuit board, wherein the specific pattern comprises a plurality of metal lines having varying lengths and pitches;
an integrated circuit die for processing information received from the fingerprint sensor mounted to the second surface and electrically coupled to the fingerprint sensor array;
wherein the circuit board is mounted to the housing such that the fingerprint sensor array is positioned in alignment within an aperture in the housing.
10. The mobile device as recited in claim 9 , wherein the fingerprint sensor array comprises a capacitive the fingerprint sensor array.
11. The mobile device as recited in claim 9 , wherein the integrated circuit die is mounted to the second surface of the circuit board at a location directly opposite and in alignment with the fingerprint sensor array location on the first surface of the circuit board.
12. The mobile device as recited in claim 9 , wherein the circuit board further includes a plurality of electrical contacts fabricated onto one of the top surface or bottom surface, wherein the plurality of electrical contacts are coupled to the integrated circuit via a plurality of signal traces.
13. The mobile device as recited in claim 12 , further comprising a flexible strip including a plurality of signal traces mated directly to the plurality of electrical contacts of the circuit board without a connector, thereby forming a connectorless electrical mating between the flexible strip and the electrical contacts.
14. The mobile device as recited in claim 13 , wherein the flexible strip is mechanically secured to the circuit board by a screw used to secure the circuit board to the housing.
15. The mobile device as recited in claim 9 , wherein the integrated circuit die is directly mounted and electrically bonded to the circuit board without having an integrated circuit package assembly.
16. The mobile device as recited in claim 15 , wherein the integrated circuit die is electrically bonded to the circuit board using electrical signal bonding wires that are bonded directly from bond pads on the integrated circuit die to contact pads formed on the circuit board.