IP Library Granted Patent US 8,306,264
Granted Patent B2
US 8,306,264 · App. 12/380,432 · Granted Nov 6, 2012

Section processing method and its apparatus

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Quick Facts
Patent No.
US 8,306,264
App. No.
12/380,432
Granted
Nov 6, 2012
Kind
B2
Abstract

A section processing apparatus has a mark forming control portion that transmits control information for forming marks on a surface of a sample. Each of the marks has at least two portions intersecting at a converging portion located at a previously determined position of an observation target section of the sample or in the vicinity of the previously determined position. A first focused ion beam apparatus emits a first focused beam for forming each of the marks on the surface of the sample based on the control information transmitted by the mark forming control portion and for processing a section of the sample. The section of the sample is processed by scanning the first focused beam in parallel with the at least two portions of the marks in the direction of the converging portion, while the section of the sample and positions of the marks are observed by a second focused ion beam apparatus, and to finish processing of the section of the sample when the first focused beam reaches the converging portion or a vicinity thereof.

Claims (11)

1. A section processing apparatus comprising:

a mark forming control portion that transmits control information for forming marks on a surface of a sample, each of the marks having at least two portions intersecting at a converging portion located at a previously determined position of an observation target section of the sample or in the vicinity of the previously determined position;

a first focused ion beam apparatus that emits a first focused beam for forming each of the marks on the surface of the sample based on the control information transmitted by the mark forming control portion and for processing a section of the sample; and

a second focused ion beam apparatus that emits a second focused beam for observing the section of the sample processed by the first focused beam of the first focused ion beam apparatus;

wherein the first focused ion beam apparatus is configured to process the section of the sample by scanning the first focused beam in parallel with the at least two portions of the marks in the direction of the converging portion, while the section of the sample being processed and positions of the marks are observed by the second focused ion beam apparatus, and to finish processing of the section of the sample when the first focused beam reaches the converging portion or a vicinity thereof.

2. A section processing apparatus according to claim 1 ; further comprising an observation image acquiring control portion for acquiring an observation image of the section of the sample being processed that is observed by the second focused ion beam apparatus.

3. A section processing apparatus according to claim 2 ; further comprising a processing position information acquiring portion for acquiring information of a processing position of the section of the sample in accordance with the observation image acquired by the observation image acquiring control portion.

4. A section processing apparatus according to claim 1 ; wherein the at least two portions of each mark comprises at least two grooves formed by the first focused beam emitted by the first focused ion beam apparatus.

5. A section processing apparatus according to claim 1 ; wherein the converging portion formed by the at least two portions of each of the marks lies on an observation target line of the observation target section of the sample.

6. A section processing apparatus according to claim 1 ; wherein each of the marks is in the shape of a triangular pillar and the at least two portions of each mark comprise inner side faces of the triangular pillar intersecting at the converging portion.

7. A section processing apparatus according to claim 6 ; wherein the converging portion formed by the intersecting inner side surfaces of each triangular pillar lies on an observation target line of the observation target section of the sample.

Assignments (4)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0543 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072907/0356 →
CHANGE OF NAME Recorded Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2009
From: FUJII, TOSHIAKI; TASHIRO, JUNICHI; HASSEL-SHEARER, MIKE
To: SII NANOTECHNOLOGY INC.; SII NANOTECHNOLOGY USA INC.
Reel/Frame 023256/0828 →