Module having a stacked magnetic device and semiconductor device and method of forming the same
View Patent ↗A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.
1. A module, comprising:
a printed wiring board including a spirally shaped patterned conductor formed on an upper surface of said printed wiring board coupled to another spirally shaped patterned conductor with a same winding sense on a lower surface of said printed wiring board;
a magnetic core mounted on said upper surface of said printed wiring board proximate said patterned conductor; and
a semiconductor device mounted on an upper surface of said magnetic core.
2. The module as recited in claim 1 wherein said printed wiring board further includes upper conductive lands formed around a periphery of said upper surface of said printed wiring board.
3. The module as recited in claim 1 wherein said printed wiring board further includes lower conductive lands around a periphery of said lower surface of said printed wiring board, wherein ones of said lower conductive lands form external terminals for said module.
4. The module as recited in claim 1 wherein said printed wiring board further includes an upper conductive land on said upper surface of said printed wiring board coupled by an electrically conductive via to a lower conductive land formed on said lower surface of said printed wiring board.
5. The module as recited in claim 1 wherein a terminal of said spirally shaped patterned conductor terminates on an upper conductive land formed on said upper surface of said printed wiring board and another terminal of said spirally shaped patterned conductor is coupled by an electrically conductive via to a terminal of said another spirally shaped patterned conductor formed on said lower surface of said printed wiring board.
6. The module as recited in claim 5 wherein another terminal of said another spirally shaped patterned conductor terminates on a lower conductive land formed on said lower surface of said printed wiring board.
7. The module as recited in claim 6 further comprising an insulating material deposited on said lower surface of said printed wiring board and patterned to cover said another spirally shaped patterned conductor and said electrically conductive via.
8. The module as recited in claim 1 wherein said spirally shaped patterned conductor is formed with a layer of copper overlaid with a thin film of gold.
9. The module as recited in claim 1 wherein said magnetic core is bonded to said printed wiring board by depositing epoxy dots on said upper surface thereof, pressing said magnetic core on to said epoxy dots and then curing said epoxy dots.
10. The module as recited in claim 1 wherein said magnetic core is formed by depositing a magnetic material on to a non-electrically conductive carrier in a molded package.
11. The module as recited in claim 10 wherein said non-electrically conductive carrier is a substantially undoped silicon die.
12. The module as recited in claim 1 wherein said magnetic core is formed by depositing a seed layer of a conductive material on to a non-electrically conductive carrier and a magnetic thin-film material on to said seed layer in a molded package.
13. The module as recited in claim 12 wherein said magnetic thin-film material includes a metallic alloy.
14. The module as recited in claim 13 wherein said metallic alloy includes ones of iron, cobalt, and nickel.
15. The module as recited in claim 1 wherein said magnetic core is formed with a relatively high magnetic permeability material operative to produce a magnetic minor effect wherein a substantial portion of a magnetic flux produced in accordance with said spirally shaped patterned conductor is conducted within a volume of said magnetic core.
16. The module as recited in claim 1 wherein said magnetic core is a ceramic ferrite piece part in a molded package.
17. The module as recited in claim 1 wherein a pad formed on an upper surface of said semiconductor device is coupled with a wire bond to an upper conductive land formed on said upper surface of said printed wiring board.
18. The module as recited in claim 1 wherein said semiconductor device is bonded to said magnetic core by depositing epoxy dots on said upper surface thereof, pressing said semiconductor device on to said epoxy dots and then curing said epoxy dots.
19. The module as recited in claim 1 wherein said module is a power module and said semiconductor device includes at least one switch and a controller therefor.
20. The module as recited in claim 1 further comprising an encapsulant about portions of said printed wiring board, said magnetic core and said semiconductor device.