Module having a stacked magnetic device and semiconductor device and method of forming the same
View Patent ↗A module having a stacked magnetic device and semiconductor device, and method of forming the same. In one embodiment, the module includes a printed wiring board including a patterned conductor formed on an upper surface thereof. The module also includes a magnetic core mounted on the upper surface of the printed wiring board proximate the patterned conductor and a semiconductor device mounted on an upper surface of the magnetic core.
1. A method of forming a stacked module having a magnetic core and a semiconductor device, comprising:
providing a printed wiring board;
forming a patterned conductor on an upper surface of said printed wiring board;
mounting a magnetic core having a relatively high magnetic permeability on said upper surface of said printed wiring board proximate said patterned conductor; and
mounting a semiconductor device directly above an upper surface of said magnetic core.
2. The method as recited in claim 1 wherein said patterned conductor is a spirally shaped conductor.
3. The method as recited in claim 1 further comprising forming upper conductive lands around a periphery of said upper surface of said printed wiring board and lower conductive lands around a periphery of a lower surface of said printed wiring board, wherein ones of said lower conductive lands form external terminals for said module.
4. The method as recited in claim 1 further comprising forming an upper conductive land on said upper surface of said printed wiring board coupled by an electrically conductive via to a lower conductive land formed on a lower surface of said printed wiring board.
5. The method as recited in claim 1 wherein a terminal of said patterned conductor terminates on an upper conductive land formed on said upper surface of said printed wiring board and another terminal of said patterned conductor is coupled by an electrically conductive via to a terminal of another patterned conductor formed on a lower surface of said printed wiring board.
6. The method as recited in claim 5 wherein another terminal of said another patterned conductor terminates on a lower conductive land formed on said lower surface of said printed wiring board.
7. The method as recited in claim 6 further comprising depositing an insulating material on said lower surface of said printed wiring board over said another patterned conductor and said electrically conductive via.
8. The method as recited in claim 1 wherein said patterned conductor is formed with a layer of copper overlaid with a thin film of gold.
9. The method as recited in claim 1 wherein mounting said magnetic core includes depositing epoxy dots on said upper surface of said printed wiring board, pressing said magnetic core on to said epoxy dots and then curing said epoxy dots.
10. The method as recited in claim 1 further comprising forming said magnetic core by depositing a magnetic material on to a non-electrically conductive carrier in a molded package.
11. The method as recited in claim 10 wherein said non-electrically conductive carrier is a substantially undoped silicon die.
12. The method as recited in claim 1 further comprising forming said magnetic core by depositing a seed layer of a conductive material on to a non-electrically conductive carrier and a magnetic thin-film material on to said seed layer in a molded package.
13. The method as recited in claim 12 wherein said magnetic thin-film material includes a metallic alloy.
14. The method as recited in claim 13 wherein said metallic alloy includes ones of iron, cobalt, and nickel.
15. The method as recited in claim 1 wherein said magnetic core is formed with a relatively high magnetic permeability material operative to produce a magnetic minor effect wherein a substantial portion of a magnetic flux produced in accordance with said patterned conductor is conducted within a volume of said magnetic core.
16. The method as recited in claim 1 further comprising forming said magnetic core as a ceramic ferrite piece part in a molded package.
17. The method as recited in claim 1 further comprising coupling a pad formed on an upper surface of said semiconductor device with a wire bond to an upper conductive land formed on said upper surface of said printed wiring board.
18. The method as recited in claim 1 wherein mounting said semiconductor device includes depositing epoxy dots on said upper surface of said magnetic core, pressing said semiconductor device on to said epoxy dots and then curing said epoxy dots.
19. The method as recited in claim 1 wherein said module is a power module and said semiconductor device includes at least one switch and a controller therefor.
20. The method as recited in claim 1 further comprising encapsulating portions of said printed wiring board, said magnetic core and said semiconductor device with an encapsulant.