IP Library Granted Patent US 8,334,577
Granted Patent B2
US 8,334,577 · App. 12/402,196 · Granted Dec 18, 2012

Semiconductor device

Assignee: Future Light, LLC
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Quick Facts
Patent No.
US 8,334,577
App. No.
12/402,196
Granted
Dec 18, 2012
Kind
B2
Abstract

A semiconductor device includes a semiconductor substrate formed of at least two kinds of group III elements and nitrogen, an active layer formed on the semiconductor substrate, and a nitride semiconductor layer formed on a surface of the semiconductor substrate and formed between the semiconductor substrate and the active layer. The nitride semiconductor layer is formed of the same constituent elements of the semiconductor substrate. A composition ratio of the lightest element among the group III elements of the nitride semiconductor layer is higher than a composition ratio of the corresponding element of the semiconductor substrate.

Claims (12)

1. A semiconductor device, comprising:

a semiconductor substrate formed of at least Ga and nitrogen;

an active layer formed on the semiconductor substrate; and

a nitride semiconductor layer formed on a surface of the semiconductor substrate between the semiconductor substrate and the active layer;

wherein a composition ratio of Ga in the nitride semiconductor layer is higher than a composition ratio of Ga in the semiconductor substrate, and

wherein the semiconductor substrate is a single layer.

2. The semiconductor device according to claim 1 , wherein the semiconductor substrate is InGaN.

3. The semiconductor device according to claim 1 , wherein the active layer is InGaN.

4. The semiconductor device according to claim 1 , wherein the nitride semiconductor layer is InGaN.

5. The semiconductor device according to claim 1 , further comprising a cladding layer formed of the same constituent element as a constituent element of the semiconductor substrate.

6. The semiconductor device according to claim 1 , wherein the nitride semiconductor layer is formed to contact with the surface of the semiconductor substrate.

7. The semiconductor device according to claim 1 , wherein the nitride semiconductor layer is formed as an altered layer where the surface of the semiconductor substrate is altered.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2017
From: SANYO ELECTRIC CO., LTD.
To: EPISTAR CORPORATION
Reel/Frame 041652/0122 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2016
From: FUTURE LIGHT LIMITED LIABILITY COMPANY
To: SANYO ELECTRIC CO., LTD.
Reel/Frame 040523/0797 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2012
From: SANYO ELECTRIC CO., LTD.
To: FUTURE LIGHT, LLC
Reel/Frame 027957/0258 →
Priority Claims (1)
JP 2005-263264 · Sep 12, 2005 · national
Continuity (2)
Division 11518235 · Sep 11, 2006
Related Publication 20090174035A1 · Jul 9, 2009