IP Library Granted Patent US 8,183,085
Granted Patent B2
US 8,183,085 · App. 12/416,094 · Granted May 22, 2012

High rate selective polymer growth on a substrate

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Quick Facts
Patent No.
US 8,183,085
App. No.
12/416,094
Granted
May 22, 2012
Kind
B2
Abstract

Method and systems provide growth of polymer structures at a high rate in a selective manner. In various embodiments, the method or system can expose the growth site to a polymer source and growing a polymer tube at a rate of at least 80 micrometer per hour at the growth site. The method or system can provide selectivity by providing a growth site on a substrate by patterning a metal, such as copper, that provides a seed site for the polymer. Non-selected sites can be coated with a polymer growth inhibitor, such as polyimide or silicon nitride.

Claims (22)

1. A method, comprising:

providing a growth site on a substrate;

exposing the growth site to a polymer source; and

growing a polymer tube at a rate of at least 80 micrometer per hour at the growth site.

2. The method of claim 1 , wherein growing a polymer tube includes growing polymer tubes with a diameter of less than one micrometer.

3. The method of claim 1 , wherein growing a polymer tube includes controlling the length of the polymer tube by controlling exposure time to the polymer source.

4. The method of claim 1 , wherein growing a polymer tube includes growing polymer tubes with a diameter at a nanometer scale.

5. The method of claim 1 , wherein providing a growth site includes patterning copper on a solid semiconductor substrate.

6. The method of claim 5 , wherein patterning copper includes uniformly coating a silicon wafer with a copper layer and forming a pattern layer to expose select portions of the copper layer.

7. The method of claim 6 , wherein forming a pattern layer includes patterning using at least one of lithography and etching.

8. The method of claim 7 , wherein forming a pattern layer includes forming a pattern layer of at least one of polyimide and silicon-nitride.

9. A method comprising:

exposing a growth site to a polymer source at a temperature of less than 50 degrees Celsius; and

growing a vertical polymer structure at a rate of at least 80 micrometer per hour at the growth site.

10. The method of claim 9 , wherein growing a vertical polymer structure includes growing a polymer structure with a width of less than one micrometer.

11. The method of claim 9 , wherein growing a vertical polymer structure includes controlling the length of the polymer tube by controlling exposure time to the polymer source.

12. The method of claim 9 , wherein growing a vertical polymer structure includes growing a polymer tube with a diameter at a nanometer scale.

13. The method of claim 9 , wherein exposing a growth site includes:

patterning copper on a solid semiconductor substrate; and

selectively exposing the copper to create growth sites.

14. The method of claim 13 , wherein selectively exposing includes selectively coating the copper with at least one of polyimide and silicon-nitride.

15. The method of claim 9 , wherein growing a vertical polymer structure includes controlling density of the polymer by controlling volume of a reactive species of the polymer.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2011
From: NUMONYX B.V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 027126/0176 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2010
From: BAR-SADEH, EYAL; AMIR, NURIEL; RIPP, ALEXANDER; SHOR, YAKOV; HORVITZ, DROR
To: NUMONYX B.V.
Reel/Frame 024685/0770 →