IP Library Granted Patent US 8,795,032
Granted Patent B2
US 8,795,032 · App. 12/457,175 · Granted Aug 5, 2014

Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Inventors: Mitsuru Miyazaki (Tokyo, JP); Seiji Katsuoka (Tokyo, JP); Naoki Matsuda (Tokyo, JP); Junji Kunisawa (Tokyo, JP); Kenichi Kobayashi (Tokyo, JP); Hiroshi Sotozaki (Tokyo, JP); Hiroyuki Shinozaki (Tokyo, JP); Osamu Nabeya (Tokyo, JP); Shinya Morisawa (Tokyo, JP); Takahiro Ogawa (Tokyo, JP); Natsuki Makino (Tochigi, JP)
Assignee: Ebara Corporation
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Quick Facts
Patent No.
US 8,795,032
App. No.
12/457,175
Filed
Jun 3, 2009
Granted
Aug 5, 2014
Kind
B2
Art Unit
3723
USPC
451/54
Abstract

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Claims (38)

1. An apparatus for processing a substrate, said apparatus comprising:

a polishing section having plural polishing units each configured to polish a substrate;

a transfer mechanism configured to transfer the substrate between said plural polishing units; and

a cleaning section configured to clean and dry the polished substrate,

wherein said transfer mechanism includes

plural transfer stages arranged on two travel axes at different heights,

plural horizontal drive mechanisms configured to move said plural transfer stages along the two travel axes in horizontal directions, and

plural elevating mechanisms configured to move said plural transfer stages independently in vertical directions.

2. The apparatus according to claim 1 , further comprising:

a pass stage arranged on a travel axis at a height differing from the heights of said two travel axes; and

a horizontal drive mechanism configured to move said pass stage along the travel axis in a horizontal direction.

3. An apparatus for processing a substrate, said apparatus comprising:

a polishing section having a vertically-movable top ring configured to hold a substrate, said top ring including a top ring body and a retainer ring which is vertically movable relative to said top ring body;

a transfer mechanism having a vertically-movable transfer stage configured to transfer and receive the substrate to and from said top ring; and

a retainer ring station arranged between said top ring and said transfer stage, said retainer ring station including a push-up mechanism configured to push said retainer ring upward relative to said top ring body.

4. The apparatus according to claim 3 , wherein said push-up mechanism includes a push-up pin arranged to be brought into contact with said retainer ring, and a spring configured to push said push-up pin upward.

5. The apparatus according to claim 3 , wherein said retainer ring station has a wear measuring device configured to measure an amount of wear of said retainer ring while said push-up mechanism is pushing said retainer ring upward relative to said top ring body.

6. The apparatus according to claim 5 , wherein said wear measuring device includes a contact member arranged to be brought into contact with a lower surface of said retainer ring, a spring configured to push said contact member upward, a linear guide vertically movably supporting said contact member, and a displacement measuring device configured to measure a displacement of said contact member.

7. The apparatus according to claim 3 , wherein said push-up mechanism is one of a plurality of push-up mechanisms, each of said push-up mechanisms including:

a push-up pin arranged to be brought into contact with said retainer ring; and

a spring configured to push said push-up pin upwardly.

8. A retainer ring station on which a top ring is to be placed, the top ring having a top ring body and a retainer ring which is vertically movable relative to the top ring body, said retainer ring station comprising:

a push-up mechanism configured to push the retainer ring upward relative to the top ring body.

9. The retainer ring station according to claim 8 , wherein said push-up mechanism includes a push-up pin arranged to be brought into contact with said retainer ring, and a spring configured to push said push-up pin upward.

10. The retainer ring station according to claim 8 , wherein said retainer ring station has a wear measuring device configured to measure an amount of wear of said retainer ring while said push-up mechanism is pushing said retainer ring upward relative to the top ring body.

11. The retainer ring station according to claim 8 , wherein said wear measuring device includes a contact member arranged to be brought into contact with a lower surface of said retainer ring, a spring configured to push said contact member upward, a linear guide vertically movably supporting said contact member, and a displacement measuring device configured to measure a displacement of said contact member.

12. The retainer ring station according to claim 8 , wherein said push-up mechanism is one of a plurality of push-up mechanisms, each of said push-up mechanisms including:

a push-up pin arranged to be brought into contact with said retainer ring; and

a spring configured to push said push-up pin upwardly.

13. A method of processing a substrate, said method comprising:

moving a top ring to a transfer position;

transferring a substrate to the transfer position by a transfer stage;

lowering the top ring to bring a retainer ring of the top ring into contact with a push-up mechanism to cause the push-up mechanism to push the retainer ring upward relative to a top ring body of the top ring;

during said lowering of the top ring, elevating the transfer stage;

transferring the substrate from the transfer stage to the top ring;

moving the substrate from the transfer position to a polishing position; and

polishing the substrate.

14. The method according to claim 13 , wherein said lowering of the top ring to bring a retainer ring of the top ring into contact with a push-up mechanism comprises lowering the top ring to bring the retainer ring of the top ring into contact with a plurality of push-up mechanisms to cause the push-up mechanisms to push the retainer ring upward.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2009
From: MIYAZAKI, MITSURU; KATSUOKA, SEIJI; MATSUDA, NAOKI; KUNISAWA, JUNJI; KOBAYASHI, KENICHI; SOTOZAKI, HIROSHI; SHINOZAKI, HIROYUKI; NABEYA, OSAMU; MORISAWA, SHINYA; OGAWA, TAKAHIRO; MAKINO, NATSUKI
To: EBARA CORPORATION
Reel/Frame 022821/0283 →
Priority Claims (3)
JP 2008-147220 · Jun 4, 2008 · national
JP 2008-190834 · Jul 24, 2008 · national
JP 2009-108671 · Apr 28, 2009 · national
Continuity (1)
Related Publication 20090305612A1 · Dec 10, 2009