IP Library Granted Patent US 8,179,463
Granted Patent B1
US 8,179,463 · App. 12/468,581 · Granted May 15, 2012

Image sensor with shared node

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Quick Facts
Patent No.
US 8,179,463
App. No.
12/468,581
Granted
May 15, 2012
Kind
B1
Abstract

In accordance with an embodiment of the present invention, an image sensor comprises a plurality of pixel sensing circuits. Each pixel sensing circuit includes a photodiode and a storage node. Each pixel sensing circuit further includes a first transistor coupled between the photodiode and the storage node and a second transistor coupled between the photodiode and a shared node. The shared node is coupled to the plurality of pixel sensing circuits. The image sensor may include a reset transistor and/or a read-out circuit coupled to the shared node.

Claims (12)

1. An image sensor device comprising:

a plurality of pixel sensing circuits, each pixel sensing circuit comprising:

a photodiode;

a storage node;

a first transistor serving as a first transfer gate coupled between the photodiode and the storage node;

a second transistor serving as a second transfer gate coupled between the photodiode and a shared node, wherein said shared node is coupled to said plurality of pixel sensing circuits;

a third transistor coupled to said storage node for resetting said each of said pixel sensing circuit;

a fourth transistor serving as a source follower transistor coupled to said storage node; and

a fifth transistor coupled to said source follower transistor configured for selecting said each of said plurality of pixel sensing circuits to a column line.

2. The image sensor device of claim 1 further comprising a read out circuit coupled to said shared node.

3. The image sensor device of claim 2 wherein said read out circuit comprises a source follower transistor coupled to a transistor for selecting an output of said shared node.

4. The image sensor device of claim 1 further comprising a transistor for resetting said plurality of pixel sensing circuits coupled to said shared node.

Assignments (2)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →