Integrated circuit having a bulk acoustic wave device and a transistor
View Patent ↗A bulk GaN layer is on a first surface of a substrate, wherein the bulk GaN layer has a GaN transistor region and a bulk acoustic wave (BAW) device region. A source/drain layer is over a first surface of the bulk GaN layer in the GaN transistor region. A gate electrode is formed over the source/drain layer. A first BAW electrode is formed over the first surface of the bulk GaN layer in the BAW device region. An opening is formed in a second surface of the substrate, opposite the first surface of the substrate, which extends through the substrate and exposes a second surface of the bulk GaN layer, opposite the first surface of the bulk GaN layer. A second BAW electrode is formed within the opening over the second surface of the bulk GaN layer.
1. A method for making a structure using a substrate, a bulk GaN layer on a first surface of the substrate, wherein the bulk GaN layer has a GaN transistor region and a bulk acoustic wave (BAW) device region, and a source/drain layer over a first surface of the bulk GaN layer in the GaN transistor region, the method comprising:
forming a gate electrode over the source/drain layer;
forming a first BAW electrode over the first surface of the bulk GaN layer in the BAW device region;
forming an opening in a second surface of the substrate, opposite the first surface of the substrate, wherein the opening extends through the substrate and exposes a second surface of the bulk GaN layer, opposite the first surface of the bulk GaN layer; and
forming a second BAW electrode within the opening in the second surface of the substrate and in contact with the exposed second surface of the bulk GaN layer, wherein the first surface of the bulk GaN layer is between the source/drain layer and the second surface of the bulk GaN layer, and the first surface of the substrate is between the bulk GaN layer and the second surface of the substrate.
2. The method of claim 1 , further comprising:
forming a first source/drain contact over the source/drain layer;
forming a second source/drain contact over the source/drain layer, wherein the gate electrode is between the first and second source/drain contact; and
forming a second opening in the second surface of the substrate, wherein the second opening extends through the substrate, the bulk GaN layer, the source/drain layer, and the first source/drain contact.
3. The method of claim 2 , further comprising:
forming a metal layer within the second opening and in contact with the first source/drain contact.
4. The method of claim 2 , further comprising:
forming a metal interconnect connecting the second source/drain contact and the first BAW electrode.
5. The method of claim 1 , wherein prior to the forming the opening in the second surface of the substrate, the method further comprises:
applying an adhesive material over the first surface of the substrate and attaching the adhesive material to a carrier.
6. The method of claim 1 , wherein the source/drain layer further comprises a first layer over the bulk GaN layer, wherein the first layer comprises AlGaN, and a second layer over the first layer, wherein the second layer comprises GaN.
7. The method of claim 1 , wherein the source/drain layer is over the first surface of the bulk GaN layer in the GaN transistor region and in the BAW device region, and wherein the method further comprises:
removing portions of the source/drain layer in the BAW device region prior to forming the first BAW electrode.
8. The method of claim 7 , further comprising:
forming a first passivation layer over the source/drain layer prior to the removing the portions of the source/drain layer in the BAW device region; and
forming a second passivation layer over the first passivation layer after the removing the portions of the source/drain layer in the BAW device region.
9. The method of claim 1 , wherein the substrate comprises SiC.
10. The method of claim 1 , wherein the gate electrode and the first BAW electrode are formed from a same patterned metal layer.
11. A method comprising:
providing an epitaxially grown bulk GaN layer on a first surface of a substrate, wherein the bulk GaN layer has a GaN transistor region and a bulk acoustic wave (BAW) device region adjacent the GaN transistor region, and a source/drain layer over a first surface of the bulk GaN layer;
removing portions of the source/drain layer from the BAW device region;
forming a source contact over the source/drain layer and a drain contact over the source/drain layer;
forming a patterned metal layer over the source/drain layer in the GaN transistor region and over the first surface of the bulk GaN layer in the BAW device region, wherein the patterned metal layer comprises a first portion which forms a gate electrode over the source/drain layer in the GaN transistor region and a second portion which forms a first BAW electrode over the first surface of the bulk GaN layer in the BAW device region;
forming an opening in a second surface of the substrate, opposite the first surface of the substrate, wherein the opening extends through the substrate and exposes a second surface of the bulk GaN layer, opposite the first surface of the bulk GaN layer; and
forming a second BAW electrode within the opening in the second surface of the substrate and in contact with the exposed second surface of the bulk GaN layer, wherein the first surface of the bulk GaN layer is between the source/drain layer and the second surface of the bulk GaN layer, and the first surface of the substrate is between the bulk GaN layer and the second surface of the substrate.
12. The method of claim 11 , further comprising:
forming a first passivation layer over the source/drain layer prior to the removing the portions of the source/drain layer in the BAW device region; and
forming a second passivation layer over the first passivation layer after the removing the portions of the source/drain layer in the BAW device region.
13. The method of claim 12 , wherein prior to the forming the patterned metal layer, the method further comprises:
forming a second opening through the first passivation layer and the second passivation layer, wherein the second opening exposes the source/drain layer, and wherein the first portion of the patterned metal layer is located over the second opening and contacts the source/drain layer.
14. The method of claim 11 , further comprising:
forming a second opening in the second surface of the substrate, wherein the second opening extends through the substrate, the bulk GaN layer, the source/drain layer, and the source contact.
15. The method of claim 14 , further comprising:
forming a conductive layer within the second opening and in contact with the source contact.
16. The method of claim 14 , further comprising:
forming a metal interconnect over the first surface of the substrate connecting the drain contact and the first BAW electrode.
17. The method of claim 11 , wherein prior to the forming the opening in the second surface of the substrate, the method further comprises:
applying an adhesive material over the first surface of the substrate and attaching the adhesive material to a carrier.
18. The method of claim 11 , wherein the source/drain layer further comprises a first layer over the bulk GaN layer, wherein the first layer comprises AlGaN, and a second layer over the first layer, wherein the second layer comprises GaN.
19. The method of claim 11 , wherein the substrate comprises SiC.