Semiconductor device and method of manufacturing the same
View Patent ↗The invention is directed to providing a smaller semiconductor device formed as an optical sensor including a light receiving portion and a light emitting portion. A light receiving portion and a light emitting portion are disposed on a front surface of a semiconductor substrate for forming a semiconductor die, and a supporting body is attached to these so as to face these with an adhesive being interposed therebetween. A first opening exposing the light receiving portion from the front side of the supporting body is provided, and in a separated position therefrom, a second opening exposing the light emitting portion from the front side of the supporting body is provided. A first electrode and a second electrode are further disposed on the front surface of the semiconductor substrate, and bump electrodes electrically connected to these are disposed on the back surface of the semiconductor substrate.
1. A semiconductor device comprising:
a semiconductor substrate having a front surface which comprises a first region and a second region that is separated from the first region;
a light receiving portion disposed on the front surface in the first region;
a light emitting portion disposed on the front surface in the second region;
an insulation film covering the front surface of the semiconductor substrate;
an electrode disposed on the insulation film;
a supporting body attached to the front surface of the semiconductor substrate;
an adhesive layer comprising an organic resin and attaching the supporting body to the front surface so as to cover the insulation film and the electrode; and
a bump electrode disposed on a back surface of the semiconductor substrate and electrically connected to the electrode,
wherein a first opening is formed to penetrate the supporting body and the adhesive layer so as to expose the light receiving portion,
a second opening is formed to penetrate the supporting body and the adhesive layer so as to expose the light emitting portion, and
the first opening is different from the second opening.
2. The semiconductor device of claim 1 , wherein the supporting body comprises a semiconductor substrate.
3. The semiconductor device of claim 1 , further comprising light-transmitting fillers filling the first and second openings.
4. The semiconductor device of claim 3 , wherein the fillers fill the first and second openings so as to form a curved top portion in each of the first and second openings.
5. The semiconductor device of claim 1 , wherein the light receiving portion comprises a photodiode.
6. The semiconductor device of claim 1 , wherein the light emitting portion comprises an LED.
7. The semiconductor device of claim 1 , further comprising a protection film covering ends of the insulation film, the adhesive layer and the supporting body.
8. The semiconductor device of claim 1 , further comprising a control circuit formed on the front surface of the semiconductor substrate and controlling at least one of the light receiving portion and the light emitting portion.