Flexible job preparation and control
View Patent ↗Preparation of a wafer processing or measuring tool for a job can be initiated prior to assigning a wafer carrier to deliver wafers to the tool. The automated process may include transfer of wafers from a container, such as a bare wafer stocker, or between two tools.
1. An automated method comprising:
receiving a wafer load request from a tool interface;
selecting a wafer lot not yet in a carrier in response to the wafer load request;
transmitting a job preparation identifying the selected wafer lot to the tool interface without specifying a carrier;
assigning a carrier to the selected wafer lot subsequent to transmitting the job preparation;
transferring the selected wafer lot from a bare wafer stocker (BWS) to the assigned carrier;
delivering the carrier to a tool associated with the tool interface; and
applying the tool to the wafer lot.
2. The method according to claim 1 , wherein the carrier comprises a front opening unified pod (FOUP).
3. The method according to claim 1 , wherein the carrier comprises a single or dual wafer transport carrier or pod (SOUP).
4. The method according to claim 1 , further comprising:
updating the job preparation after transferring the wafer lot to the assigned carrier.
5. The method according to claim 4 , further comprising:
transmitting the updated job preparation to the tool interface.
6. An apparatus comprising:
a bare wafer stocker (BWS);
a tool interface;
a tool associated with the tool interface; and
a processor configured to:
receive a wafer load request from the tool interface;
select a wafer lot not yet in a carrier in response to the wafer load request;
transmit a job preparation identifying the selected wafer lot without specifying a carrier;
assign a carrier to the selected wafer lot subsequent to transmitting the job preparation;
transfer the selected wafer lot from the BWS to the assigned carrier;
deliver the carrier to the tool; and
apply the tool to the wafer lot.
7. The apparatus according to claim 6 , wherein the carrier comprises a FOUP.
8. The apparatus according to claim 7 , further comprising an automated material handling system interface for moving FOUPs between a load port on the tool and a load port on another tool.
9. The apparatus according to claim 6 , wherein the carrier comprises a SOUP.
10. The apparatus according to claim 6 , the processor further configured to update the job preparation after transferring the wafer lot to the assigned carrier.
11. The apparatus according to claim 10 , the processor further configured to transmit the updated job preparation to the tool interface.
12. An automated method comprising:
receiving a wafer load request from a tool interface;
selecting a wafer lot not yet in a FOUP in response to the wafer load request;
transmitting a job preparation identifying the selected wafer lot to the tool interface without specifying a FOUP;
assigning a FOUP to the wafer lot;
transferring the wafer lot from a bare wafer stocker (BWS) to the assigned FOUP;
updating the job preparation to identify the assigned FOUP;
delivering the FOUP to a semiconductor processing tool associated with the tool interface; and
performing the semiconductor process on the wafer lot using the semiconductor processing tool.