COPACKING CONFIGURATIONS FOR NONPOLAR GaN AND/OR SEMIPOLAR GaN LEDs
A packaged light emitting device. The device has a substrate member comprising a surface region. The device has a substrate member comprising a surface region. The device also has two or more light emitting diode devices overlying the surface region according to a specific embodiment. At least a first of the light emitting diode device is fabricated on a semipolar GaN containing substrate and at least a second of the light emitting diode devices is fabricated on a nonpolar GaN containing substrate. In a preferred embodiment, the two or more light emitting diode devices emits substantially polarized emission. Of course, there can be other variations, modifications, and alternatives.
1 . A packaged light emitting device comprising:
a substrate member comprising a surface region;
two or more light emitting diode devices overlying the surface region, at least a first of the light emitting diode device being fabricated on a semipolar gallium and nitrogen containing substrate and at least a second of the light emitting diode devices being fabricated on a nonpolar gallium and nitrogen containing substrate, the two or more light emitting diode devices emits substantially polarized emission.
2 . The device of claim 1 wherein the first of the light emitting diode devices comprising a blue LED device and the second of the light emitting diode devices comprising a yellow LED device, the substantially polarized emission being white light.
3 . The device of claim 1 wherein the first of the light emitting diode devices comprising a yellow LED device and the second of the light emitting diode devices comprising a blue LED device, the substantially polarized emission being white light.
4 . The device of claim 1 wherein the two or more light emitting diode device comprises an array of LED devices comprising a pair of blue LED devices and a pair of yellow LED devices.
5 . The device of claim 1 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, and a green LED device.
6 . The device of claim 1 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, a yellow LED device, and a green LED device.
7 . The device of claim 1 further comprising an Nth LED device, the Nth LED device being fabricated on an arsenide or phosphide containing substrate.
8 . The device of claim 7 wherein the phosphide containing substrate is derived from an AlInGaP containing material.
9 . The device of claim 1 further comprising further comprising an integrated circuit device, the integrated circuit device being fabricated on a silicon containing substrate.
10 . A packaged light emitting device comprising:
a substrate member comprising a surface region;
two or more light emitting diode devices overlying the surface region, at least a first of the light emitting diode device being fabricated on a semipolar gallium and nitrogen containing substrate and at least a second of the light emitting diode devices comprising a polar gallium and nitrogen containing device.
11 . The device of claim 10 wherein the first of the light emitting diode devices comprising a blue LED device and the second of the light emitting diode devices comprising a yellow LED device.
12 . The device of claim 10 wherein the first of the light emitting diode devices comprising a yellow LED device and the second of the light emitting diode devices comprising a blue LED device.
13 . The device of claim 10 wherein the two or more light emitting diode devices comprise an array of LED devices.
14 . The device of claim 10 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, and a green LED device.
15 . The device of claim 10 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, a yellow LED device, and a green LED device.
16 . The device of claim 10 further comprising an Nth LED device, the Nth LED device being fabricated on an arsenide or phosphide containing substrate.
17 . The device of claim 16 wherein the phosphide containing substrate is derived from an AlInGaP containing material.
18 . The device of claim 10 further comprising further comprising an integrated circuit device, the integrated circuit device being fabricated on a silicon containing substrate.
19 . A packaged light emitting device comprising:
a substrate member comprising a surface region;
two or more light emitting diode devices overlying the surface region, at least a first of the light emitting diode device being fabricated on a non-polar gallium and nitrogen containing substrate and at least a second of the light emitting diode devices comprising a polar gallium and nitrogen containing device.
20 . The device of claim 19 wherein the first of the light emitting diode devices comprising a blue LED device and the second of the light emitting diode devices comprising a yellow LED device.
21 . The device of claim 19 wherein the first of the light emitting diode devices comprising a yellow LED device and the second of the light emitting diode devices comprising a blue LED device.
22 . The device of claim 19 wherein the two or more light emitting diode devices comprise an array of LED devices.
23 . The device of claim 19 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, and a green LED device.
24 . The device of claim 19 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, a yellow LED device, and a green LED device.
25 . The device of claim 19 further comprising an Nth LED device, the Nth LED device being fabricated on an arsenide or phosphide containing substrate.
26 . The device of claim 25 wherein the phosphide containing substrate is derived from an AlInGaP containing material.
27 . The device of claim 19 further comprising further comprising an integrated circuit device, the integrated circuit device being fabricated on a silicon containing substrate.
28 . A packaged light emitting device comprising:
a substrate member comprising a surface region;
two or more light emitting diode devices overlying the surface region, at least a first of the light emitting diode device being fabricated on a semi-polar gallium and nitrogen containing substrate and at least a second of the light emitting diode devices being fabricated on a semi-polar gallium and nitrogen containing substrate.
29 . The device of claim 28 wherein the first of the light emitting diode devices comprising a blue LED device and the second of the light emitting diode devices comprising a yellow LED device.
30 . The device of claim 28 wherein the two or more light emitting diode devices comprise an array of LED devices.
31 . The device of claim 28 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, and a green LED device.
32 . The device of claim 28 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, a yellow LED device, and a green LED device.
33 . The device of claim 28 further comprising an Nth LED device, the Nth LED device being fabricated on an arsenide or phosphide containing substrate.
34 . The device of claim 33 wherein the phosphide containing substrate is derived from an AlInGaP containing material.
35 . The device of claim 28 further comprising further comprising an integrated circuit device, the integrated circuit device being fabricated on a silicon containing substrate.
36 . A packaged light emitting device comprising:
a substrate member comprising a surface region;
two or more light emitting diode devices overlying the surface region, at least a first of the light emitting diode device being fabricated on a non-polar gallium and nitrogen containing substrate and at least a second of the light emitting diode devices being fabricated on a non-polar gallium and nitrogen containing substrate.
37 . The device of claim 36 wherein the first of the light emitting diode devices comprising a blue LED device and the second of the light emitting diode devices comprising a yellow LED device.
38 . The device of claim 36 wherein the two or more light emitting diode devices comprise an array of LED devices.
39 . The device of claim 36 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, and a green LED device.
40 . The device of claim 36 wherein the two or more light emitting diode devices comprises at least a red LED device, a blue LED device, a yellow LED device, and a green LED device.
41 . The device of claim 36 further comprising an Nth LED device, the Nth LED device being fabricated on an arsenide or phosphide containing substrate.
42 . The device of claim 41 wherein the phosphide containing substrate is derived from an AlInGaP containing material.
43 . The device of claim 36 further comprising further comprising an integrated circuit device, the integrated circuit device being fabricated on a silicon containing substrate.