IP Library Granted Patent US 8,289,761
Granted Patent B2
US 8,289,761 · App. 12/492,820 · Granted Oct 16, 2012

Nonvolatile memory cell, nonvolatile memory device and method for driving the same

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Quick Facts
Patent No.
US 8,289,761
App. No.
12/492,820
Granted
Oct 16, 2012
Kind
B2
Abstract

A nonvolatile memory cell is able to reduce the size per the unit area by employing a dual gate structure where the chalcogenide compound is used for a channel. The nonvolatile memory cell includes a phase-change layer, a first and a second gate that are in contact with sides of the phase-change layer to face each other across the phase-change layer and control a current flowing through the phase-change layer by each gate being arranged to induce the phase transition of the phase-change layer independently of the other.

Claims (17)

1. A nonvolatile memory cell, comprising:

a phase-change layer; and

a first gate and a second gate that are formed on sides of the phase-change layer to face each other across the phase-change layer and control a current flowing through the phase-change layer by each gate being arranged to induce the phase transition of the phase-change layer independently of the other gate, wherein the first and second gates are each in direct contact with the phase-change layer.

2. The nonvolatile memory cell of claim 1 , wherein the first gate is formed on one side of the phase-change layer and changes a crystalline state of a first surrounding region of the phase-change layer using heat generated by a current supplied thereto so that the first surrounding region has a high or low resistance characteristic, wherein the first gate is formed on the first surrounding region of the phase-change layer.

3. The nonvolatile memory cell of claim 2 , wherein the second gate is formed on the other side of the phase-change layer and changes a crystalline state of a second surrounding region of the phase-change layer using heat generated by a current supplied thereto so that the second surrounding region has a high or low resistance characteristic, wherein the second gate is formed on the second surrounding region of the phase-change layer.

4. A method for driving a nonvolatile memory cell, the method comprising:

a data writing step of writing data by supplying a reset current or a set current to a first gate;

a pre-readout step of supplying the reset current to a second gate; and

a readout step of reading out the data by detecting a state of a readout current supplied to a phase-change layer, wherein the nonvolatile memory cell includes the phase-change layer and includes the first and second gates formed on sides of the phase-change layer to face each other across the phase-change layer and to control a current flowing through the phase-change layer by each gate being arranged to induce the phase transition of the phase-change layer independently of the other gate and wherein the first and second gates are each in direct contact with the phase-change layer.

5. The method of claim 4 , after the readout step, further comprising a post-readout step of supplying the set current to the second gate.

6. The method of claim 5 , wherein, in the post-readout step, a surrounding region of the phase-change layer that is formed on the second gate is changed from a polycrystalline state to an amorphous state.

7. The method of claim 5 , wherein, in the data writing step, the pre-readout step and the post-readout step, a ground voltage is supplied to the phase-change layer.

8. The method of claim 4 , wherein, in the data writing step, data having a logic value ‘1’ is written in case where the reset current is supplied.

9. The method of claim 4 , wherein, in the data writing step, data having a logic value ‘0’ is written in case where the set current is supplied.

10. The method of claim 4 , wherein, in the data writing step, a surrounding region of the phase-change layer that is formed on the first gate is changed from a polycrystalline state to an amorphous state in case where the reset current is supplied.

11. The method of claim 4 , wherein, in the data writing step, a surrounding region of the phase-change layer that is formed on the first gate is changed to a polycrystalline state in case where the set current is supplied.

12. The method of claim 4 , wherein, in the pre-readout step, a surrounding region of the phase-change layer that is formed on the second gate is changed from a polycrystalline state to an amorphous state in case where the reset current is supplied.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2009
From: PARK, HAE-CHAN; DO, GAP-SOK; LEE, JANG-UK
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 022882/0893 →