IP Library › Granted Patent US 8,780,522
Granted Patent B2
US 8,780,522 · App. 12/498,939 · Granted Jul 15, 2014

Capacitively-coupled electrostatic (CCE) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof

Inventors: Jean-Paul Booth (Essonne, FR); Douglas L. Keil (Fremont, CA)
Assignee: Lam Research Corporation
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Quick Facts
Patent No.
US 8,780,522
App. No.
12/498,939
Granted
Jul 15, 2014
Kind
B2
Abstract

A method for identifying a signal perturbation characteristic of a dechucking event within a processing chamber of a plasma processing system is provided. The method includes executing a dechucking step within the processing chamber to remove a substrate from a lower electrode, wherein the dechucking step includes generating plasma capable of providing a current to neutralize an electrostatic charge on the substrate. The method also includes employing a probe head to collect a set of characteristic parameter measurements during the dechucking step. The probe head is on a surface of the processing chamber, wherein the surface is within close proximity to a substrate surface. The method further includes comparing the set of characteristic parameter measurements against a pre-defined range. If the set of characteristic parameter measurements is within the pre-defined range, the electrostatic charge is removed from the substrate and the signal perturbation characteristic of the dechucking event is detected.

Claims (30)

1. A method for identifying a signal perturbation characteristic of a dechucking event within a processing chamber of a plasma processing system, comprising:

executing a dechucking step within said processing chamber to remove a substrate from a lower electrode, wherein said dechucking step includes generating a plasma capable of providing a current to neutralize an electrostatic charge on said substrate;

employing a probe head to collect a set of characteristic parameter measurements of data related to characterizing said plasma capable of providing current during said dechucking step, said probe head being on a surface of said processing chamber, wherein said surface is within close proximity to a substrate surface; and

comparing said set of characteristic parameter measurements against a pre-defined range of data related to characterizing said plasma capable of providing current, if said set of characteristic parameter measurements is within said pre-defined range, said electrostatic charge is removed from said substrate and said signal perturbation characteristic of said dechucking event is detected.

2. The method of claim 1 wherein said probe head is a capacitively-coupled electrostatic (CCE) probe.

3. The method of claim 2 wherein said probe head is a small device, wherein a plasma-facing surface of said probe head is made from a material similar to other plasma-facing components of said processing chamber.

4. The method of claim 1 wherein said set of characteristic parameter measurements is a set of ion flux measurements.

5. The method of claim 1 wherein said set of characteristic parameter measurements is a set of electron temperature measurements.

6. The method of claim 1 wherein said set of characteristic parameter measurements is a set of floating potential measurements.

7. The method of claim 1 wherein if said set of characteristic parameter measurements is not within said pre-defined range, said electrostatic charge is not neutralized and said dechucking event is not terminated.

8. An arrangement for identifying a signal perturbation characteristic of a dechucking event within a processing chamber of a plasma processing system, comprising:

a substrate, wherein said substrate is positioned on a lower electrode within said processing chamber;

means for creating a plasma capable of providing a current to neutralize an electrostatic charge on said substrate;

a probe arrangement, wherein said probe arrangement includes a plasma-facing sensor and is disposed on a surface of said processing chamber, said surface is within close proximity to a surface of said substrate, wherein said probe arrangement is configured at least to collect a set of characteristic parameter measurements of data related to characteristics of said plasma capable of providing current during a dechucking step; and

a detection module, wherein said detection module is configured to compare said set of characteristic parameter measurements against a pre-defined range of data related to characteristics of said plasma capable of providing current, if said set of characteristic parameter measurements is within said pre-defined range, said electrostatic charge is removed from said substrate and said signal perturbation characteristic of said dechucking event is detected.

9. The arrangement of claim 8 wherein said plasma-facing sensor is a capacitively-coupled electrostatic (CCE) probe head.

10. The arrangement of claim 9 wherein said plasma-facing sensor is a small device, wherein a plasma-facing surface of said plasma-facing sensor is made from a material similar to other plasma-facing components of said processing chamber.

11. The arrangement of claim 8 wherein said set of characteristic parameter measurements is a set of ion flux measurements.

12. The arrangement of claim 8 wherein said set of characteristic parameter measurements is a set of electron temperature measurements.

13. The arrangement of claim 8 wherein said set of characteristic parameter measurements is a set of floating potential measurements.

14. The arrangement of claim 8 wherein said detection module is a software algorithm.

15. The arrangement of claim 8 wherein if said detection module is unable to determine said removal of said electrostatic charge from said substrate, corrective actions are applied.

16. An article of manufacture comprising a program storage medium having computer readable code embodied therein, said computer readable code being configured for identifying a signal perturbation characteristic of a dechucking event within a processing chamber of a plasma processing system, comprising:

code for executing a dechucking step within said processing chamber to remove a substrate from a lower electrode, wherein said dechucking step includes generating a plasma capable of providing a current to neutralize an electrostatic charge on said substrate;

code for employing a probe head to collect a set of characteristic parameter measurements of data related to characteristics of said plasma capable of providing current during said dechucking step, said probe head being on a surface of said processing chamber, wherein said surface is within close proximity to a substrate surface; and

code for comparing said set of characteristic parameter measurements against a pre-defined range of data related to characteristics of said plasma capable of providing current, if said set of characteristic parameter measurements is within said pre-defined range, said electrostatic charge is removed from said substrate and said signal perturbation characteristics of said dechucking event is detected.

17. The article of manufacture of claim 16 wherein said probe head is a capacitively-coupled electrostatic (CCE) probe.

18. The article of manufacture of claim 16 wherein said set characteristic parameter measurements is one of a set of ion flux measurements, a set of electron temperature measurements, and a set of floating potential measurements.

19. The article of manufacture of claim 16 wherein if said set of characteristic parameter measurements is not within said pre-defined range, said electrostatic charge is not neutralized and said dechucking event is not terminated.

20. The article of manufacture of claim 16 wherein said code for comparing of said set of characteristic parameter measurements against said pre-defined range is performed by a detection module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2009
From: BOOTH, JEAN PAUL; KEIL, DOUGLAS L.
To: LAM RESEARCH CORPORATION
Reel/Frame 023500/0311 →
Continuity (2)
Provisional Application 61078742 · Jul 7, 2008
Related Publication 20100008015A1 · Jan 14, 2010