Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
View Patent ↗Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
1. An apparatus for wafer dicing comprising:
a wafer containing plurality of integrated circuits;
a dicing saw; and
a dicing solution for wafer dicing consisting essentially of:
at least one dicarboxylic acid and/or salt thereof;
at least one hydroxycarboxylic acid and/or salt thereof or amine group containing acid;
a surfactant selected from the group consisting of phosphate esters branched alcohol ethoxylate based surfactant;
alkyldiphenyloxide disulfonic acid based surfactant having a structure of:
wherein R is an alkyl group having 10 to 12 carbon atoms;
dodecyl benzene sulfonic acid (DDBSA) based surfactant having a structure of:
secondary alkyl sulfonic acid based surfactant having a structure of:
wherein 10<m+n<14;
and combinations thereof; and
the remainder being substantially deionized water;
wherein the dicing solution is fluoride-free and having a pH of about 1 to about 4; and the dicing solution is effective in inhibiting adherence of the contamination residues to exposed metallization areas and the corrosion of the exposed metallization areas.
2. The apparatus of claim 1 , wherein the at least one dicarboxylic acid, salt thereof is about 0.005 to about 16% by weight;
the at least one hydroxy carboxylic acid, salt thereof is about 0.003 to about 4% by weight;
the surfactant is about 0.0001 to about 0.5% by weight; and
the remainder being substantially deionized water.
3. The apparatus of claim 2 , wherein the dicarboxylic acid is selected from the group consisting of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid and fumaric acid.
4. The apparatus of claim 2 , wherein the dicarboxylic acid comprises a mixture of malonic acid and oxalic acid.
5. The apparatus of claim 2 comprises citric acid, malonic acid, oxalic acid and deionized water.
6. The apparatus of claim 1 comprises 4.0% citric acid, 2.0% malonic acid, 4.0% oxalic acid, 0.4% of the surfactant, and the remainder being substantially deionized water.
7. The apparatus of claim 6 , wherein the surfactant is a secondary alkyl sulfonic acid based surfactant having a structure of:
wherein 10<m+n<14.
8. A An apparatus for wafer dicing comprising:
a wafer containing plurality of integrated circuits;
a dicing saw; and
a dicing solution (a solution for wafer dicing) consisting essentially of:
4.0% citric acid;
2.0% malonic acid;
4.0% oxalic acid;
0.4% of a surfactant selected from the group consisting of phosphate esters branched alcohol ethoxylate based surfactant;
alkyldiphenyloxide disulfonic acid based surfactant having a structure of:
wherein R is an alkyl group having 10 to 12 carbon atoms;
dodecyl benzene sulfonic acid (DDBSA) based surfactant having a structure of:
secondary alkyl sulfonic acid based surfactant having a structure of:
wherein 10<m+n<14;
and combinations thereof; and
the remainder being substantially deionized water;
wherein the dicing solution having a pH of about 1 to about 4; and
the dicing solution is effective in inhibiting adherence of contamination residues to exposed metallization areas and effective in inhibiting corrosion of the exposed metallization areas.
9. apparatus of claim 8 , wherein the surfactant is a secondary alkyl sulfonic acid based surfactant having a structure of:
wherein 10<m+n<14.