Methods for fabricating semiconductor devices
View Patent ↗Methods are provided for fabricating a semiconductor device on and in a semiconductor substrate. In one embodiment, a method comprises the steps of forming etch masking features overlying the semiconductor substrate, the etch masking features having a first thickness, and forming an etch barrier layer overlying the substrate, the etch barrier layer having a second thickness less than or substantially equal to the first thickness. The method also comprises removing the etch masking features to expose the substrate, and etching the substrate using the etch barrier layer as an etch mask.
1. A method of fabricating a semiconductor device on and in a semiconductor substrate comprising the steps of:
forming etch masking features overlying the semiconductor substrate, the etch masking features having a first thickness;
forming an etch barrier layer overlying the substrate, the etch barrier layer having a second thickness less than or substantially equal to the first thickness, wherein the etch barrier layer comprises solvated silicon-comprising material;
removing the etch masking features to expose the substrate; and
etching the substrate using the etch barrier layer as an etch mask.
2. The method of claim 1 , wherein the step of forming etch masking features comprises:
forming a first masking layer overlying the substrate; and
patterning the first masking layer.
3. The method of claim 2 , wherein the step of forming etch masking features further comprises:
freezing the first masking layer after the step of patterning the first masking layer;
forming a second patterned layer overlying the substrate, the second patterned layer having a second thickness greater than or less than the first thickness;
forming an etch barrier layer overlying the substrate, the etch barrier layer having a third thickness less than or substantially equal to the smaller of the first thickness and the second thickness.
4. The method of claim 2 , wherein the step of forming etch masking features further comprises:
freezing the first masking layer after the step of patterning the first masking layer;
forming a second masking layer overlying the substrate, the second masking layer having a third thickness greater than or substantially equal to the second thickness; and
patterning the second masking layer.
5. The method of claim 4 , wherein the step of patterning the second masking layer is performed before the step of forming an etch barrier layer.
6. The method of claim 1 , wherein the step of forming etch masking features comprises:
forming a mandrel overlying the substrate, the mandrel having side surfaces;
forming a spacer layer overlying the substrate and the mandrel;
anisotropically etching the spacer layer to form sidewall spacers overlying the side surfaces of the mandrel; and
removing the mandrel.
7. The method of claim 6 , wherein the step of forming a spacer layer comprises forming a spacer layer having a composition selected from a group consisting of silicon oxides, silicon nitrides, amorphous carbon, and silicon oxynitrides.
8. The method of claim 6 , wherein the step of forming a spacer layer comprises forming an organic spacer layer.
9. The method of claim 1 , wherein the substrate comprises an anti-reflective layer, and wherein the step of etching the substrate comprises etching the anti-reflective layer.
10. The method of claim 1 , further comprising the step of removing the etch barrier layer after the step of etching the substrate.
11. A method of fabricating a semiconductor device on and in a semiconductor substrate comprising the steps of:
forming a first patterned layer overlying the substrate, the first patterned layer having a first thickness;
freezing the first patterned layer;
forming a second patterned layer overlying the substrate, the second patterned layer having a second thickness greater than or less than the first thickness;
forming an etch barrier layer overlying the substrate, the etch barrier layer having a third thickness less than or substantially equal to the smaller of the first thickness and the second thickness, wherein the etch barrier layer comprises solvated silicon-comprising material;
removing the first patterned layer and the second patterned layer, and
etching the substrate using the etch barrier layer as an etch mask.
12. The method of claim 11 , wherein the step of removing the first patterned layer and the second patterned layer comprises ashing the first patterned layer and the second patterned layer.
13. A method of fabricating a semiconductor device on and in a semiconductor substrate comprising the steps of:
forming a mandrel overlying the substrate, the mandrel having side surfaces;
forming sidewall spacers overlying the side surfaces of the mandrel, the sidewall spacers having a first thickness;
removing the mandrel;
forming an etch barrier layer overlying the substrate, the etch barrier layer having a second thickness less than or substantially equal to the first thickness, wherein the etch barrier layer comprises solvated silicon-comprising material;
removing the sidewall spacers to expose the substrate; and
etching the substrate using the etch barrier layer as an etch mask.
14. The method of claim 13 , wherein the step of forming sidewall spacers comprises forming organic sidewall spacers.
15. The method of claim 14 , wherein the step of forming an etch barrier layer comprises forming a silicon-comprising etch barrier layer.
16. The method of claim 14 , wherein the step of removing the sidewall spacers comprises ashing the sidewall spacers.
17. The method of claim 13 , wherein the step of forming sidewall spacers comprises forming inorganic sidewall spacers.
18. The method of claim 17 , wherein the step of forming an etch barrier layer comprises forming an organic etch barrier layer.
19. The method of claim 18 , further comprising the step of ashing the etch barrier layer.