Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame
View Patent ↗To provide a semiconductor device and a semiconductor module in which breakage of a semiconductor element due to a pressing force given from the outside is prevented. A semiconductor device according to the present invention has a configuration mainly including an island, a semiconductor element mounted on a front surface of the island, a lead that functions as an external connection terminal, and a sealing resin that covers these components in an integrated manner and mechanically supports them. Further, a through-hole is provided so as to penetrate the sealing resin. A front surface of the sealing resin around the through-hole forms a flat part. The front surface of the sealing resin that overlaps the semiconductor element is depressed inward with respect to the flat part to form a depressed part.
1. A semiconductor device, comprising:
an island;
a semiconductor element mounted on a main surface of the island;
a sealing resin that seals the island and the semiconductor element in an integrated manner;
a through-hole provided so as to penetrate the sealing resin in a thickness direction thereof; and
a flat part formed in a main surface of the sealing resin at a periphery of the through-hole,
wherein the main surface of the sealing resin in a region overlapping the semiconductor element is depressed with respect to the flat part to form a depressed part.
2. The semiconductor device according to claim 1 , wherein the sealing resin is formed so that a region in which the flat part and the depressed part are provided is formed thinner than other regions.
3. The semiconductor device according to claim 1 , wherein the depressed part is provided so as to continue to the flat part.
4. The semiconductor device according to claim 1 , wherein the flat part is provided in any region of the main surface of the sealing resin except a region on which the semiconductor element is placed.
5. A semiconductor module including a semiconductor device and a heat dissipating member that is in contact with the semiconductor device, wherein
the semiconductor device includes:
an island;
a semiconductor element mounted on a main surface of the island;
a sealing resin that seals the island and the semiconductor element in an integrated manner;
a through-hole provided so as to penetrate the sealing resin in a thickness direction thereof; and
a flat part formed in a main surface of the sealing resin at a periphery of the through-hole,
the main surface of the sealing resin in a region overlapping the semiconductor element is depressed with respect to the flat part to form a depressed part,
the semiconductor device is brought into contact with the heat dissipating member by a pressing member that penetrates the through-hole of the semiconductor device and presses a main surface of the semiconductor device, and
the pressing member is in contact with the flat part of the semiconductor device except the region overlapping the semiconductor element.
6. The semiconductor module according to claim 5 , wherein the pressing member includes a screw inserted into the through-hole of the semiconductor device and a washer interposed between a head of the screw and the semiconductor device, and a main surface of the washer is in contact with the flat part of the semiconductor device.