Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
A chemical mechanical polishing aqueous dispersion includes (A) colloidal silica having an average particle size calculated from the specific surface area determined by the BET method of 10 to 60 nm, (B) an organic acid having two or more carboxyl groups and one or more hydroxyl groups in one molecule, and (C) a quaternary ammonium compound shown by the following general formula (1), wherein R 1 to R 4 individually represent hydrocarbon groups, and M − represents an anion, the chemical mechanical polishing aqueous dispersion having a pH of 3 to 5.
1. A chemical mechanical polishing aqueous dispersion comprising:
(A) colloidal silica having an average particle size calculated from the specific surface area determined by the BET method of 10 to 60 nm;
(B) an organic acid having two or more carboxyl groups and one or more hydroxyl groups in one molecule; and
(C) a quaternary ammonium compound represented by formula (I),
wherein R 1 to R 4 individually represent hydrocarbon groups, and M − represents an anion,
the chemical mechanical polishing aqueous dispersion having a pH of 3 to 5, and
wherein the ratio of the major axis (Rmax) to the minor axis (Rmin) of the colloidal silica particles (A) is greater than 1.3.
2. The chemical mechanical polishing aqueous dispersion according to claim 1 , wherein (B) is at least one organic acid selected from tartaric acid, malic acid, and citric acid.
3. The chemical mechanical polishing aqueous dispersion according to claim 1 , further comprising phosphoric acid or a derivative of phosphoric acid.
4. The chemical mechanical polishing aqueous dispersion according to claim 1 , wherein the mass ratio of the component (B) to the component (A) is 0.02 to 10.
5. The chemical mechanical polishing aqueous dispersion according to claim 1 , wherein the chemical mechanical polishing aqueous dispersion has a polishing rate ratio of a silicon nitride film to a silicon oxide film of greater than 10.
6. A chemical mechanical polishing method for a semiconductor device that includes a silicon oxide film and a silicon nitride film formed on the silicon oxide film,
said method comprising:
selectively polishing the silicon nitride film by using the chemical mechanical polishing aqueous dispersion according to claim 1 ; and
stopping the polishing when the surface of the silicon oxide film is exposed.
7. A chemical mechanical polishing aqueous dispersion comprising:
(A) colloidal silica having an average particle size calculated from the specific surface area determined by the BET method of 10 to 60 nm;
(B) an organic acid having two or more carboxyl groups and one or more hydroxyl groups in one molecule;
(C) a quaternary ammonium compound represented by formula (I),
wherein R 1 to R 4 individually represent hydrocarbon groups, and M − represents an anion, the chemical mechanical polishing aqueous dispersion having a pH of 3 to 5, and
wherein the ratio of the major axis (Rmax) to the minor axis (Rmin) of the colloidal silica particles (A) is 1.0 to 1.3.
8. The chemical mechanical polishing aqueous dispersion according to claim 7 , wherein (B) is at least one organic acid selected from tartaric acid, malic acid, and citric acid.
9. The chemical mechanical polishing aqueous dispersion according to claim 7 , further comprising phosphoric acid or a derivative of phosphoric acid.
10. The chemical mechanical polishing aqueous dispersion according to claim 7 , wherein the mass ratio of (B) to (A) is 0.02 to 10.
11. The chemical mechanical polishing aqueous dispersion according to claim 7 , wherein the chemical mechanical polishing aqueous dispersion has a polishing rate ratio of a silicon nitride film to a silicon oxide film of 0.7 to 1.4.
12. A chemical mechanical polishing method for a semiconductor device that includes a silicon oxide film and a silicon nitride film on the surface of the semiconductor device, comprising:
simultaneously polishing the silicon oxide film and the silicon nitride film by using the chemical mechanical polishing aqueous dispersion according to claim 7 .