Photomask inspection method, semiconductor device inspection method, and pattern inspection apparatus
A plurality of photomasks used to manufacture the same semiconductor device, each of the photomasks having a plurality of mutually replaceable unit regions set therein, are inspected to detect a defect. It is determined whether or not the detected defect has a redundancy defect positioned in a unit region replaceable with another unit region to remedy the photomask. Then, when inspecting the second or subsequent photomask, a unit region including the coordinate of a redundancy defect detected in another photomask inspected previously is set to be a non-inspection region, and the non-inspection region is not inspected.
1. A pattern inspection apparatus for inspecting a plurality of photomasks each used to manufacture a same semiconductor device, the photomasks each including a plurality of mutually replaceable unit regions set therein, the apparatus comprising:
a redundancy map storage unit storing a redundancy map indicating a disposition of the unit regions;
an image capture unit for acquiring optical images of the photomasks;
a defect determination unit which:
compares an acquired optical image of a first one of the photomasks to a reference image associated with the first one of the photomasks to detect a defect,
determines whether a detected defect is a redundancy defect positioned in a first one of the unit regions replaceable with a second one of the unit regions to render usable the first one of the photomasks,
updates the redundancy map to record a coordinate of the redundancy defect, and
outputs information regarding the detected defect; and
a control unit which:
identifies, for a second one of the photomasks, one of the unit regions on the second one of the photomasks that includes the coordinate of the detected redundancy defect as a redundancy-relevant region on the second one of the photomasks, and
instructs the image capture unit not to inspect the redundancy-relevant region.
2. A pattern inspection apparatus for inspecting an intermediate structural body at each stage of a plurality of manufacturing stages of a semiconductor device, the intermediate structural body at each stage including a plurality of mutually replaceable unit regions set therein, the apparatus comprising:
a redundancy map storage unit storing a redundancy map indicating a disposition of the unit regions;
an image capture unit for acquiring optical images of the intermediate structural body at the plurality of manufacturing stages;
a defect determination unit which:
compares an acquired optical image of the intermediate structural body at a first stage to a reference image associated with the intermediate structural body at the first stage to detect a defect,
determines whether a detected defect is a redundancy defect positioned in a first one of the unit regions replaceable with a second one of the unit regions to remedy the intermediate structural body,
updates the redundancy map to record a coordinate of the redundancy defect, and
outputs information regarding the detected defect; and
a control unit which:
identifies, for the intermediate structural body at a second stage, one of the unit regions on the intermediate structural body at the second stage that includes the coordinate of the detected redundancy defect as a redundancy-relevant region, and
instructs the image capture unit not to inspect the redundancy-relevant region.
3. The apparatus according to claim 1 , further comprising a reference image creation unit creating the reference image based on design data of the first one of the photomasks.
4. The apparatus according to claim 2 , further comprising a reference image creation unit creating the reference image based on design data of the intermediate structural body at the first stage.
5. The apparatus according to claim 1 , wherein the control unit further instructs the defect determination unit not to output information of a defect detected in the redundancy-relevant region.
6. The apparatus according to claim 2 , wherein the control unit further instructs the defect determination unit not to output information of a defect detected in the redundancy-relevant region.