Lateral DMOS field effect transistor with reduced threshold voltage and self-aligned drift region
View Patent ↗A method of forming a lateral DMOS transistor includes performing a low energy implantation using a first dopant type and being applied to the entire device area. The dopants of the low energy implantation are blocked by the conductive gate. The method further includes performing a high energy implantation using a third dopant type and being applied to the entire device area. The dopants of the high energy implantation penetrate the conductive gate and is introduced into the entire device active area including underneath the conductive gate. After annealing, a double-diffused lightly doped drain (DLDD) region is formed from the high and low energy implantations and is used as a drift region of the lateral DMOS transistor. The DLDD region overlaps with the body region at a channel region and interacts with the dopants of the body region to adjust a threshold voltage of the lateral DMOS transistor.
1. A method of forming a lateral DMOS transistor, comprising:
providing a semiconductor layer of a first conductivity type;
defining an active area in which the lateral DMOS transistor is formed;
forming a conductive gate in the active area insulated from the semiconductor layer by a first dielectric layer, the conductive gate delineating a first region and a second region in the semiconductor layer;
performing a first implantation using a first type of dopants of the first conductivity type, the first implantation being selectively applied to only the first region in the semiconductor layer;
performing a second implantation using a second type of dopants of a second conductivity type, the second implantation being selectively applied to only the first region in the semiconductor layer;
performing a third implantation using the first type of dopants of the first conductivity type, the third implantation being a low energy implantation and being applied to the entire active area, the dopants of the third implantation being blocked by the conductive gate and being introduced into the semiconductor layer in the first and second regions only;
performing a fourth implantation using a third type of dopants of the first conductivity type, the fourth implantation being a high energy implantation and being applied to the entire active area, the dopants of the fourth implantation penetrating the conductive gate and being introduced into the semiconductor layer in the first and second regions and underneath the conductive gate;
annealing the semiconductor layer to form a source region from the first implantation, a body region from the second implantation, the source region being formed in the body region, and a double-diffused lightly doped drain region as a drift region from the third and fourth implantations, the double-diffused lightly doped drain region formed from the fourth implantation extending under the conductive gate into and overlapping with the body region at a channel region of the lateral DMOS transistor, the dopants of the double-diffused lightly doped drain region interacting with the dopants of the body region to adjust a threshold voltage of the lateral DMOS transistor.
2. The method of claim 1 , further comprising:
forming sidewall spacers adjacent to the conductive gate;
forming a first heavily doped region of the first conductivity type in the source region of the semiconductor layer and self-aligned to the sidewall spacer of the conductive gate;
forming a second heavily doped region of the first conductivity type in the drain region of the semiconductor layer; and
forming a third heavily doped region of the second conductivity type at least partially in the body region of the semiconductor layer.
3. The method of claim 2 , wherein forming a second heavily doped region of the first conductivity type in the drain region of the semiconductor layer comprises forming the second heavily doped region apart from the conductive gate.
4. The method of claim 2 , wherein forming a second heavily doped region of the first conductivity type in the drain region of the semiconductor layer comprises forming the second heavily doped region self-aligned to the sidewall spacer of the conductive gate.
5. The method of claim 1 , further comprising:
forming the first dielectric layer on the top surface of the semiconductor layer, the first dielectric layer forming a gate dielectric layer of the lateral DMOS transistor.
6. The method of claim 1 , wherein defining an active area in which the lateral DMOS transistor is formed comprises defining the active area using a field oxide layer, the field oxide layer surrounding the active area.
7. The method of claim 1 , wherein the semiconductor layer comprises an epitaxial layer of the first conductivity type.
8. The method of claim 1 , wherein the first conductivity type is P-type and the second conductivity type is N-type.
9. The method of claim 1 , wherein the first conductivity type is N-type and the second conductivity type is P-type, the first type of dopants of the first conductivity type comprises arsenic, the second type of dopants of the second conductivity type comprises boron and the third type of dopants of the first conductivity type comprises phosphorus.
10. A lateral DMOS transistor, comprising:
a semiconductor layer of a first conductivity type;
a field oxide layer formed on the top surface of the semiconductor layer defining an active area in which the lateral DMOS transistor is formed;
a conductive gate formed in the active area insulated from the semiconductor layer by a first dielectric layer, the conductive gate delineating a first region and a second region in the semiconductor layer;
a body region of a second conductivity type formed in the first region of the semiconductor layer, a part of the body region extending underneath the conductive gate;
a source region of the first conductivity type formed in the body region of the semiconductor layer, a part of the source region extending underneath the conductive gate; and
a double-diffused lightly doped drain region of the first conductivity type formed in the second region of the semiconductor layer, the double-diffused lightly doped drain region being a drift region of the lateral DMOS transistor, a part of the double-diffused lightly doped drain region extending underneath the conductive gate into and overlapping with the body region at a channel region of the lateral DMOS transistor, dopants of the double-diffused lightly doped drain region interacting with dopants of the body region to adjust a threshold voltage of the lateral DMOS transistor.
11. The lateral DMOS transistor of claim 10 , further comprising:
sidewall spacers formed adjacent to the conductive gate;
a first heavily doped region of the first conductivity type formed in the source region of the semiconductor layer and self-aligned to the sidewall spacer of the conductive gate;
a second heavily doped region of the first conductivity type formed in the drain region of the semiconductor layer; and
a third heavily doped region of the second conductivity type formed at least partially in the body region of the semiconductor layer.
12. The lateral DMOS transistor of claim 11 , wherein the second heavily doped region is formed apart from the conductive gate.
13. The lateral DMOS transistor of claim 11 , wherein the second heavily doped region is formed self-aligned to the sidewall spacer of the conductive gate.
14. The lateral DMOS transistor of claim 10 , wherein the semiconductor layer comprises an epitaxial layer of the first conductivity type.
15. The lateral DMOS transistor of claim 10 , wherein the first conductivity type is P-type and the second conductivity type is N-type.
16. The lateral DMOS transistor of claim 10 , wherein the first conductivity type is N-type and the second conductivity type is P-type, the double-diffused lightly doped drain region being formed from a first low energy implantation step using arsenic and a second high energy implantation step using phosphorus.