IP Library Granted Patent US 8,833,089
Granted Patent B2
US 8,833,089 · App. 12/538,986 · Granted Sep 16, 2014

Plasma processing apparatus and maintenance method therefor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,833,089
App. No.
12/538,986
Granted
Sep 16, 2014
Kind
B2
Abstract

In a plasma processing apparatus, a check valve is installed close to a refrigerant inlet of a compressor. When performing maintenance of a sample stage, refrigerant collected from a refrigerant flow path is temporarily stored in a flow path section extending from an expansion valve to the check valve, making it possible to perform the maintenance without changing the amount of refrigerant in the refrigerating cycle. With a refrigerant storage tank, a refrigerant supply valve, and a refrigerant discharge valve included in the refrigerating cycle, when maintenance of the compressor, a condenser, or the expansion valve is performed, the refrigerant collected from the refrigerating cycle can be put in use again.

Claims (39)

1. A plasma processing apparatus which has a vacuum process chamber including a sample stage installed therein and which generates a plasma from a process gas introduced thereinto and processes, using the plasma, a surface of a sample placed on the sample stage, the plasma processing apparatus comprising:

a refrigerating cycle including a refrigerant flow path which is disposed in the sample stage, a compressor, a condenser, which are coupled by refrigerant pipes in this order and through which a refrigerant circulates in the order, the sample stage functioning as an evaporator in the refrigerating cycle;

a first valve disposed on the refrigerant pipe between the compressor and an inlet of the refrigerant flow path in the sample stage, the first valve being configured to enable to close completely;

a backflow preventing valve disposed on the refrigerant pipe between an outlet of the refrigerant flow path in the sample stage and the compressor, the backflow preventing valve being capable of preventing the refrigerant from flowing backward through the compressor; and

a control unit which controls functions of the compressor, the first valve and the backflow preventing valve respectively,

wherein the refrigerating cycle is configured to be laid out into a first flow section extending from the first valve to the backflow preventing valve and a second flow section extending from the backflow preventing valve via the compressor to the first valve, the first and second flow sections being mutually separatable, and includes a refrigerant storage tank which communicates with the refrigerant pipes in the second flow section at both positions of an upstream and a downstream of the compressor; and

wherein the control unit operates, during maintenance of one of the compressor, the condenser and the sample stage, the compressor with the first valve being closed completely to collect the refrigerant present in the first flow section into the refrigerant storage tank through the position downstream of the compressor to be temporarily stored therein, and, after the maintenance is finished, the refrigerant temporarily stored in the refrigerant storage tank is returned, by operation of the compressor, from the position upstream of the compressor and into the first flow section through the second flow section in a state in which the refrigerant is usable again in the refrigerating cycle.

2. The plasma processing apparatus according to claim 1 , the refrigerating cycle further comprising a refrigerant evaporator disposed in between the compressor and the backflow preventing valve, the refrigerant evaporator being able to completely evaporate the refrigerant.

3. The plasma processing apparatus according to claim 2 , wherein a dual refrigerant sealing structure for sealing against an internal pressure and an external pressure is used in the refrigerating cycle.

4. The plasma processing apparatus according to claim 2 , wherein the refrigerating cycle further comprises a temperature measuring unit which can monitor a load on the compressor.

5. The plasma processing apparatus according to claim 1 , wherein the first valve is a flow control valve disposed on the refrigerant pipe between the compressor and the condenser.

6. The plasma processing apparatus according to claim 1 , wherein a dual refrigerant sealing structure for sealing against an internal pressure and an external pressure is used in the refrigerating cycle.

7. The plasma processing apparatus according to claim 1 , wherein the refrigerating cycle further comprises a temperature measuring unit which can monitor a load on the compressor.

8. The plasma processing apparatus according to claim 1 , wherein the refrigerant storage tank communicates with the refrigerant pipes, at the position upstream of the compressor, in the second flow section between the backflow preventing valve and the compressor.

9. A plasma processing apparatus which has a vacuum process chamber including a sample stage installed therein and which generates a plasma from a process gas introduced thereinto and processes, using the plasma, a surface of a sample placed on the sample stage, the plasma processing apparatus comprising:

a refrigerating cycle including a refrigerant flow path which is disposed in the sample stage, a compressor, and a condenser, which are coupled by refrigerant pipes in this order and through which a refrigerant circulates in the order, the sample stage functioning as an evaporator in the refrigerating cycle;

a first valve disposed on the refrigerant pipe between the compressor and an inlet of the refrigerant flow path in the sample stage, the first valve being configured to enable to close completely;

a backflow preventing valve disposed on the refrigerant pipe between an outlet of the refrigerant flow path in the sample stage and the compressor, the backflow preventing valve being capable of preventing the refrigerant from flowing backward through the compressor; and

a control unit which controls functions of the compressor, the first valve and the backflow preventing valve respectively;

wherein the refrigerating cycle is configured to be laid out into a first flow section extending from the first valve to the backflow preventing valve and a second flow section extending from the backflow preventing valve via the compressor to the first valve, and includes a refrigerant storage tank coupled to the refrigerant pipes in the second flow section at both positions downstream and upstream of the compressor via a second valve and a third valve respectively which are configured to be able to open and close, the first and second flow sections being mutually separatable; and

wherein the control unit operates, during maintenance of one of the compressor, the condenser, and the sample stage, the compressor with the first valve being closed completely and the second valve being opened to collect the refrigerant present in the first flow section into the refrigerant storage tank to be temporarily stored therein, and, after the maintenance is finished, the refrigerant temporarily stored in the refrigerant storage tank is returned, by operation of the compressor, via the third valve which opens into the second flow section, and flows through the second flow section to the first flow section in a state in which the refrigerant is usable again in the refrigerating cycle.

10. The plasma processing apparatus according to claim 9 , wherein the refrigerant storage tank is provided with a gravimeter for monitoring a weight of refrigerant filled in the refrigerating cycle.

11. The plasma processing apparatus according to claim 9 , wherein the control unit operates the compressor, before the maintenance of the compressor is performed, to collect the refrigerant present in the first flow section into the refrigerant storage tank, and operates the second valve being closed, and, after the maintenance is finished, operates the compressor to return the refrigerant stored in the refrigerant storage tank to the second flow section in a state in which the refrigerant is usable again in the refrigerating cycle.

12. The plasma processing apparatus according to claim 9 , wherein the first valve is a flow control valve disposed on the refrigerant pipe between the compressor and the condenser.

13. The plasma processing apparatus according to claim 9 , wherein the refrigerant storage tank communicates with the refrigerant pipes, at the position upstream of the compressor, in the second flow section between the backflow preventing valve and the compressor.

14. A maintenance method for a plasma processing apparatus which has a vacuum process chamber including a sample stage installed therein and which generates a plasma from a process gas introduced thereinto and processes, using the plasma, a surface of a sample placed on the sample stage, the plasma

processing apparatus comprising:

a refrigerating cycle including a refrigerant flow path which is disposed in the sample stage, a compressor, and a condenser, which are coupled by refrigerant pipes in this order and through which a refrigerant circulates in the order, the sample stage functioning as an evaporator in the refrigerating cycle;

a first valve disposed on the refrigerant pipe between the compressor and an inlet of the refrigerant flow path in the sample stage, the first valve being configured to enable to close completely;

a backflow preventing valve disposed on the refrigerant pipe between an outlet of the refrigerant flow path in the sample stage and the compressor, the backflow preventing valve being capable of preventing the refrigerant from flowing backward through the compressor; and

a control unit which controls functions of the compressor, the first valve and the backflow preventing valve respectively,

wherein the refrigerating cycle is configured to be laid out into a first flow section extending from the first valve to the backflow preventing valve and a second flow section extending from the backflow preventing valve via the compressor to the first valve, and includes a refrigerant storage tank coupled to the refrigerant pipes in the second flow section at both positions upstream and downstream of the compressor via a second valve and a third valve respectively which are able to open and close, the first and second flow sections being mutually separatable; and

wherein, during maintenance of one of the compressor, the condenser, and the sample stage, collecting refrigerant present in the first flow section, by running the compressor with the first valve being closed completely and the second valve being open, into the refrigerant storage tank to be temporarily stored therein;

the maintenance method further comprising:

performing maintenance of the sample stage; and

after the maintenance is finished, returning the refrigerant temporarily stored in the refrigerant storage tank, by operation of the compressor, into the second flow section via the third valve which is opened and providing the refrigerant to the first flow section through the second flow section in a state in which the refrigerant is usable again in the refrigerating cycle.

15. The maintenance method for plasma processing apparatus according to claim 14 , the maintenance method further comprising a step of evaporating completely the refrigerant by a refrigerant evaporator disposed in between the compressor and the backflow preventing valve.

16. The maintenance method for the plasma processing apparatus according to claim 14 , wherein the first valve is a flow control valve disposed on the refrigerant pipe between the compressor and the condenser.

17. The maintenance method for a plasma processing apparatus according to claim 14 , wherein the refrigerant storage tank communicates with the refrigerant pipes, at the position upstream of the compressor, in the second flow section between the backflow preventing valve and the compressor.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2009
From: TANDOU, TAKUMI; IZAWA, MASARU
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 023336/0643 →