Vapor deposition reactor for forming thin film
A vapor deposition reactor includes a chamber filled with a first material, and at least one reaction module in the chamber. The reaction module may be configured to make a substrate pass the reaction module through a relative motion between the substrate and the reaction module. The reaction module may include an injection unit for injecting a second material to the substrate. A method for forming thin film includes positioning a substrate in a chamber, filling a first material in the chamber, moving the substrate relative to a reaction module in the chamber, and injecting a second material to the substrate while the substrate passes the reaction module.
1. A vapor deposition reactor for depositing material on a substrate, comprising:
a chamber filled with a first material and configured to receive a substrate, the substrate exposed to the first material in the chamber to adsorb the first material; and
a reaction module comprising an injection unit placed within the chamber to face the substrate and inject a second material onto the substrate, the substrate deposited with a layer of material by reaction of the second material with the first material adsorbed in the substrate or substitution of a portion of the first material adsorbed in the substrate with a portion of the second material, the substrate exposed to the second material as the substrate passes the injection unit by a relative motion between the substrate and the reaction module.
2. The vapor deposition reactor according to claim 1 , wherein the reaction module further comprises:
a first exhaust unit for removing a portion of an adsorption layer of the first material adsorbed in a surface of the substrate by injecting a purge gas; and
a second exhaust unit for removing a portion of an adsorption layer of the second material adsorbed in the surface of the substrate by injecting the purge gas.
3. The vapor deposition reactor according to claim 2 , wherein the first exhaust unit, the injection unit and the second exhaust unit are placed sequentially in the reaction module.
4. The vapor deposition reactor according to claim 2 , wherein each of the first exhaust unit and the second exhaust unit comprises:
a purge port for injecting the purge gas; and
a pumping port for discharging, from the chamber, the purge gas and the first material or the second material desorbed from the substrate by the purge gas.
5. The vapor deposition reactor according to claim 4 , wherein the purge gas is selected from a group consisting of N 2 , Ar, He and a combination thereof.
6. The vapor deposition reactor according to claim 1 , wherein the chamber comprises a support for holding the substrate, the support rotating in the chamber.
7. The vapor deposition reactor according to claim 1 , wherein the chamber comprises a controller for controlling pressure or flow rate of the first material into the chamber and pressure or flow rate of the second material injected onto the substrate.
8. The vapor deposition reactor according to claim 7 , wherein the controller comprises vacuum pumps.
9. The vapor deposition reactor according to claim 1 , wherein the controller comprises an apparatus for controlling a speed of the relative motion between the substrate and the reaction module.
10. The vapor deposition reactor according to claim 1 , wherein the chamber comprises a heater for controlling temperature of an interior of the chamber.
11. The vapor deposition reactor according to claim 1 , wherein the reaction module is configured to isolate the substrate passing the injection unit from the first material in the chamber.
12. The vapor deposition reactor according to claim 1 , wherein the injection unit is configured to apply plasma, ultrahigh frequency wave or UV light to the substrate.
13. The vapor deposition reactor according to claim 1 , wherein the first material is selected from a group consisting of H 2 O, H 2 O 2 , O 2 , N 2 O, O 3 , O* radical, NH 3 , NH 2 —NH 2 , N 2 , N* radical, CH 4 , C 2 H 6 , H 2 , H* radical and a combination thereof.
14. The vapor deposition reactor according to claim 1 , wherein the second material is selected from a group consisting of a group IV compound, a III-V compound, a II-VI compound, a Ni-based compound, a Co-based compound, a Cu-based compound, an Al-based compound, a Ti-based compound, a Hf-based compound, a Zr-based compound, a Ta-based compound, a Mo-based compound, a W-based compound, a Si-based compound, a Zn-based compound, and a combination thereof.