IP Library Granted Patent US 8,843,331
Granted Patent B2
US 8,843,331 · App. 12/545,437 · Granted Sep 23, 2014

Light emitting diode fault monitoring

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Quick Facts
Patent No.
US 8,843,331
App. No.
12/545,437
Granted
Sep 23, 2014
Kind
B2
Abstract

Methods, systems, and devices are described for providing fault monitoring for light emitting diode (LED) circuits. Embodiments receive an indication from a fault control module that a fault has occurred in a portion of an LED module (e.g., a series string of LEDs). The fault may represent an open fault or a closed fault condition. In some embodiments, a monitoring module receives the fault indication and generates a further representation that the fault has occurred (e.g., for use by external components or systems). In other embodiments, the monitoring module in configured to further indicate which in the LED module has failed, and/or in what fault condition (e.g., open or closed).

Claims (40)

1. A fault monitoring circuit for monitoring fault conditions in light emitting diodes (“LEDs”), the circuit comprising:

a fault detection module in electrical communication with an LED module comprising a plurality of LEDs, each of the plurality of LEDs being electrically coupled with another of the plurality of LEDs to form a series string of LEDs coupled between terminals of a power source, the fault detection module comprising a plurality of detection units, each detection unit having detector monitor terminals coupled between an anode terminal and a cathode terminal of a respective one LED of the series string of LEDs and adapted to:

detect a fault condition in the respective one of the plurality of LEDs; and

output a fault indication based upon detection of the fault condition; and

a fault monitoring module, in electrical communication with at least one of the detection units and adapted to receive the fault indication from the at least one of the detection units when a fault condition is detected by the at least one of the detection units in the respective one of the plurality of LEDs.

2. The circuit of claim 1 , wherein the fault condition is an open circuit fault condition.

3. The circuit of claim 1 , wherein each detection unit is adapted to detect the fault condition in the respective one of the plurality of LEDs by:

detecting an LED voltage across the respective one of the plurality of LEDs, the LED voltage being substantially a first voltage level when the respective one of the plurality of LEDs is operating properly and the LED voltage being substantially different from the first voltage level when the respective one of the plurality of LEDs is experiencing the fault condition.

4. The circuit of claim 3 , wherein each detection unit comprises:

a voltage-to-current converter configured to detect the LED voltage and to have a threshold voltage below which the voltage-to-current converter outputs substantially zero current and above which the voltage-to-current converter outputs substantially non-zero current,

wherein the first voltage level is substantially above the threshold voltage, such that the voltage-to-current converter outputs substantially zero current when the respective one of the plurality of LEDs is experiencing the fault condition and the voltage-to-current converter outputs substantially non-zero current when the respective one of the plurality of LEDs is operating properly.

5. The circuit of claim 4 , wherein:

each detection unit is designed such that the threshold voltage is below an operational voltage level associated with each of the plurality of LEDs, at least some of the plurality of LEDs having associated operational voltage levels that are substantially different from operational voltage levels associated with others of the plurality of LEDs.

6. The circuit of claim 3 , wherein:

the LED voltage is substantially a second voltage level when the respective one of the plurality of LEDs is experiencing an open circuit fault condition;

the LED voltage is substantially a third voltage level when the respective one of the plurality of LEDs is experiencing a closed circuit fault condition; and

the third voltage level is substantially different from the second voltage level and from the first voltage level.

7. The circuit of claim 3 , wherein each detection unit comprises:

a light detector in optical communication with at least one of the plurality of LEDs, and adapted to:

monitor light output of the at least one of the plurality of LEDs; and

detect the fault condition of the at least one of the plurality of LEDs as a function of the light output of the at least one of the plurality of LEDs.

8. The circuit of claim 7 , wherein the light detector is in optical communication with the respective one of the plurality of LEDs, and is adapted to:

monitor light output of the respective one of the plurality of LEDs; and

detect the fault condition of the respective one of the plurality of LEDs as a function of the light output of the respective one of the plurality of LEDs.

9. The circuit of claim 7 , wherein the light detector monitors light output by:

monitoring at least one of a light intensity level or a light color.

10. The circuit of claim 1 , wherein the fault monitoring module comprises:

a comparator module, configured to receive at least one fault indication from at least one detection unit and to generate a comparator output signal indicating a global fault condition in the LED module.

11. The circuit of claim 1 , wherein the fault monitoring module comprises:

a digital word generator adapted to generate a digital word as a function of the fault indication, the digital word indicating at least which of the plurality of LEDs in the LED module is experiencing the fault condition.

12. The circuit of claim 1 , wherein:

the fault detection module is a first fault detection module; and

the circuit further comprises a second fault detection module configured to be cascadably coupled with the first fault detection module.

13. The circuit of claim 1 , wherein:

each of the plurality of detection units comprises a fault detection input node and a fault detection output node; and

the fault detection output node of a first of the plurality of detection units is coupled with the fault detection input node of a second of the plurality of detection units.

14. The circuit of claim 1 , wherein:

the fault monitoring module is in communication with a second fault monitoring module, and comprises a fault monitoring input node adapted to receive fault data from the second fault monitoring module.

15. The circuit of claim 1 , further comprising:

a housing, configured to integratedly house at least the fault detection module, and comprising a set of pins, at least some of the pins being configured to provide an electrical interface between each detection unit and the respective one of the plurality of LEDs.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2025
From: POLARIS POWERLED TECHNOLOGIES, LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 070203/0047 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
CHANGE OF NAME Recorded Jan 18, 2018
From: LED DISPLAY TECHNOLOGIES, LLC
To: POLARIS POWERLED TECHNOLOGIES, LLC
Reel/Frame 045084/0315 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Sep 19, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION
Reel/Frame 043902/0544 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2017
From: MICROSEMI CORPORATION
To: LED DISPLAY TECHNOLOGIES, LLC
Reel/Frame 043137/0738 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2011
From: ASIC ADVANTAGE INC.
To: MICROSEMI CORPORATION
Reel/Frame 027096/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2009
From: IRISSOU, PIERRE; LEGOFF, STEPHANE; OCHI, SAM SEIICHIRO; COLMET-DAAGE, ETIENNE
To: ASIC ADVANTAGE INC.
Reel/Frame 023193/0530 →