Semiconductor device
View Patent ↗The first base electrodes and the first emitter electrodes are all formed like strips, and are alternately arranged in parallel, and the area of the second emitter electrode is expanded to be larger than that of the second base electrode. With this, the number of current paths increases in each of which a current is pulled up almost straight from the emitter region to the second emitter electrode through the first emitter electrodes, thereby preventing the current densities of the entire chip from becoming uneven.
1. A semiconductor device comprising:
a semiconductor substrate of a first general conductivity type configured to operate as a collector region;
a base region of a second general conductivity type formed on the substrate;
an emitter region of the first general conductivity type formed in a surface portion of the base region so as to define a plurality of isolated portions of the base region in the surface portion in plan view of the semiconductor device, the isolated portions being arranged in a matrix form comprising rows extending in a first direction and columns extending in a second direction;
a first insulating film disposed on the emitter region and the isolated portions of the base region;
a plurality of first base electrodes each disposed on and in contact with corresponding isolated portions of the base region;
a plurality of first emitter electrodes each disposed on and in contact with the emitter region;
a second insulating film disposed on the first base electrodes and the first emitter electrodes;
a second base electrode disposed on the second insulating film so as to overlay portions of the first base electrodes and portions of the first emitter electrodes and so as to be electrically in contact with the first base electrodes;
a second emitter electrode disposed on the second insulating film so as to overlay portions of the first base electrodes and portions of the first emitter electrodes and so as to be electrically in contact with the first emitter electrodes, the second base electrode being smaller in area than the second emitter electrode,
wherein all of the first base electrodes are elongated in the first direction of the matrix so that each first base electrode is disposed in a corresponding row of the matrix and is in contact with isolated portions of the corresponding row.
2. The semiconductor device of claim 1 , wherein the first emitter electrodes are elongated in the first direction.
3. The semiconductor device of claim 1 , wherein an area of the second base electrode is equal to or smaller than one third of an area of the second emitter electrode.
4. The semiconductor device of claim 1 , wherein a boundary between the second base electrode and the second emitter electrode extends in a direction perpendicular to the first direction in the plan view of the semiconductor device.
5. The semiconductor device of claim 1 , wherein the emitter region forms a lattice pattern to define the isolated portions of the base region as the matrix.
6. The semiconductor device of claim 1 , wherein the second base electrode comprises a base pad portion having a first width and a base wiring portion having a second width which is smaller than the first width, the first width is sufficient for wire bonding, and the second width is equal to or larger than a width of one cell formed of one of the isolated portions of the base region and the emitter region surrounding said one of the isolated portions.
7. The semiconductor device of claim 6 , wherein the second emitter electrode comprises an emitter wiring portion facing the base pad portion and an emitter pad portion facing the base wiring portion, and the emitter pad portion is larger than the emitter wiring portion.
8. The semiconductor device according to claim 7 , further comprising a conductive adhesive material disposed on the emitter pad portion, and a metal plate bonded to substantially a center of the emitter pad portion with the conductive adhesive material.