Method of designing semiconductor device including density verification

1. A method of designing a semiconductor device including density verification of layout data of the semiconductor device at a macro level, comprising:

disposing virtual patterns each including a predetermined step width close to a circumference of a verification frame using a processing apparatus; and

moving said verification frame outside which said virtual patterns are disposed sequentially by said predetermined step width and performing the density verification of the layout data of said semiconductor device.

2. The method of designing a semiconductor device as claimed in claim 1 , wherein said virtual patterns are disposed along the circumference of said verification frame.

3. The method of designing a semiconductor device as claimed in claim 2 , wherein said verification frame includes a rectangular shape.

4. The method of designing a semiconductor device as claimed in claim 3 , wherein said virtual patterns are virtual metal patterns that are disposed outside respective ones of all four sides of said verification frame and each of which includes said predetermined step width.

5. The method of designing a semiconductor device as claimed in claim 3 , wherein said virtual pattern is a virtual metal pattern that is disposed inside one side of said verification frame and that includes said predetermined step width.

6. The method of designing a semiconductor device as claimed in claim 2 , wherein said verification frame includes a square shape.

7. The method of designing a semiconductor device as claimed in claim 6 , wherein said virtual patterns are virtual metal patterns that are disposed outside respective ones of all four sides of said verification frame and each of which includes said predetermined step width.

8. The method of designing a semiconductor device as claimed in claim 6 , wherein said virtual pattern is a virtual metal pattern that is disposed inside one side of said verification frame and that includes said predetermined step width.

9. The method of designing a semiconductor device as claimed in claim 1 , wherein said verification frame includes a rectangular shape.

10. The method of designing a semiconductor device as claimed in claim 9 , wherein said virtual patterns are virtual metal patterns that are disposed outside respective ones of all four sides of said verification frame and each of which includes said predetermined step width.

11. The method of designing a semiconductor device as claimed in claim 9 , wherein said virtual pattern is a virtual metal pattern that is disposed inside one side of said verification frame and that includes said predetermined step width.

12. The method of designing a semiconductor device as claimed in claim 1 , wherein said verification frame includes a square shape.

13. The method of designing a semiconductor device as claimed in claim 12 , wherein said virtual patterns are virtual metal patterns that are disposed outside respective ones of all four sides of said verification frame and each of which includes said predetermined step width.

14. The method of designing a semiconductor device as claimed in claim 12 , wherein said virtual pattern is a virtual metal pattern that is disposed inside one side of said verification frame and that includes said predetermined step width.

15. The method of designing a semiconductor device as claimed in claim 1 , wherein when density of said layout data does not satisfy a predetermined standard, said virtual patterns are rearranged.

16. A computer readable storage non-transitory medium that stores a layout data verification program of a semiconductor device for making a computer to execute:

disposing virtual patterns each including a predetermined step width on a circumference of a verification frame; and

moving said verification frame outside which said virtual patterns are disposed sequentially by said predetermined step width and performing the density verification of the layout data of said semiconductor device.