Resin sheet, circuit device and method of manufacturing the same
View Patent ↗Provided is a circuit device manufacturing method for coating a bottom surface of a circuit board with a thin coating of sealing resin. In the present invention, a circuit board having a circuit element such as a semiconductor element embedded therein is placed in a molding die, and a resin sheet containing a thermosetting resin is interposed between the circuit board and a bottom surface of an inner wall of the molding die. Under this condition, the molding die is heated to about 180° C., and a sealing resin in liquid form is injected through a gate. Thereby, the bottom surface of the circuit board can be coated with a thin coating of the sealing resin made of the molten resin sheet.
1. A method of manufacturing a circuit device, comprising:
attaching a hybrid integrated circuit comprising a conductive pattern and a circuit element to a top surface of a circuit board; and
sealing top and side surfaces of the circuit board with a sealing resin containing a thermosetting resin by injecting the sealing resin into a cavity of a molding die in which the circuit board is placed,
wherein the sealing comprises coating a bottom surface of the circuit board with a molten resin sheet containing a thermosetting resin simultaneously during the sealing, the resin sheet being interposed between the circuit board and a bottom surface of an inner wall of the molding die.
2. The method of claim 1 , wherein during the sealing, the resin sheet is pressed against and thereby fixed to the bottom surface of the circuit board while leads led out of opposite side edges of the circuit board are sandwiched by the molding die, and a thickness of the sealing resin made of the molten resin sheet, coating the bottom surface of the circuit board, is less than that of the resin sheet.
3. The method of claim 1 , wherein during sealing, the resin sheet is melted, and thereafter, the sealing resin in liquid form is injected into the cavity through a gate of the molding die, and the resin sheet is heat-cured prior to the sealing resin that is injected.
4. The method of claim 3 , wherein the resin injected into the cavity through the gate of the molding die has the same composition as the resin sheet.
5. The method of claim 3 , wherein fillers contained in the sealing resin which is made of the molten resin sheet and coats the bottom surface of the circuit board, is more uniformly dispersed than fillers contained in the sealing resin which is injected through the gate and coats the top surface of the circuit board.
6. The method of claim 1 , wherein the resin sheet is made by pressure-molding the thermosetting resin in powder form yet to be heat-cured.
7. The method of claim 1 , wherein the resin sheet is formed in size larger than the circuit board, and an entire area of the bottom surface of the circuit board is coated with the resin sheet.
8. The method of claim 1 , wherein the sealing comprises coating the bottom surface of the circuit board with two or more molten resin sheets containing the thermosetting resin.
9. A method of resin-sealing a circuit element disposed on a circuit board or an island of a lead frame using a molding die, comprising:
providing a resin sheet formed by pressure-molding a resin material in powder form and containing a thermosetting resin;
placing the resin sheet in a cavity of the molding die so as to be under the circuit board or the island on which the circuit element is disposed; and
sealing the circuit element with a sealing resin and by simultaneously melting the resin sheet.
10. The method of claim 9 , wherein, during the sealing, a pellet obtained by pressure-molding the resin material in the powder form is melted by heat and is injected into the cavity so that the molten pellet and the resin sheet form the sealing resin, and the resin sheet is formed thinner than the pellet.
11. The method of claim 9 , wherein the percentage of filling of the resin sheet is equal to or more than 99%.
12. The method of claim 9 , wherein a thickness of the resin sheet is equal to or less than 0.6 mm.
13. The method of claim 9 , wherein, during the sealing, the resin sheet is placed between the circuit board and an inner wall of the molding die, and the resin sheet is melted and heat-cured so as to coat a bottom surface of the circuit board.
14. The method of claim 9 , wherein, during the sealing, the resin sheet is placed between the island and an inner wall of the molding die, and the resin sheet is melted and heat-cured so as to coat a bottom surface of the island.
15. A method of manufacturing a circuit device, comprising:
providing a semiconductor wafer comprising a plurality of semiconductor element units and external connection electrodes that are formed on a top surface of the wafer, the external connection electrodes being connected to the semiconductor element units;
sealing the top surface of the semiconductor wafer with a resin; and
dividing the semiconductor wafer into the semiconductor element units,
wherein, during the sealing, a resin sheet containing a thermosetting resin is melted so as to coat a bottom surface of the semiconductor wafer.
16. The method of claim 15 , wherein a molding die is used in the sealing, the resin sheet is placed and melted between the bottom surface of the semiconductor wafer and an inner wall of the molding die, and the top surface of the semiconductor wafer is coated with a resin injected into a cavity of the molding die.
17. The method of claim 16 , wherein the resin injected into the cavity of the molding die has the same composition as the resin sheet.
18. The method of claim 15 , wherein the resin sheet is made by pressure-molding the thermosetting resin in powder form yet to be heat-cured.