Vapor deposition reactor using plasma and method for forming thin film using the same
A vapor deposition reactor may include a first electrode including a first channel and at least one first injection hole connected to the first channel. a second electrode electrically separated from the first electrode, and a power source for applying power between the first electrode and the second electrode to generate plasma from a reactant gas between the first electrode and the second electrode. Also provided is a method for forming thin film using the vapor deposition reactor.
1. A vapor deposition reactor for depositing a thin film on a substrate, comprising:
a first electrode comprising a body formed with a first channel and an opening, at least one first injection hole connected to the first channel and reaction space located away from the substrate; and
a second electrode placed in the reaction space formed in the body of the first electrode, part of the second electrode facing away from the substrate and surrounded by the body of the first electrode to generate plasma or pulse discharge within the reaction space but part of the second electrode facing the substrate not surrounded by the body of the first electrode and communicating with the substrate via the opening, a width of the second electrode along a direction of relative movement between the vapor deposition reactor and the substrate is smaller than a width of the opening in the direction, a material injected into the reaction space between the first electrode and the second electrode via the first channel and the at least one first injection hole, the second electrode comprising:
a platform extending longitudinally in a direction parallel to a top surface of the substrate, and
at least one protrusion formed on the platform for generating the plasma or pulse discharge responsive to applying a voltage difference across the first electrode and the second electrode.
2. The vapor deposition reactor of claim 1 , wherein a second channel and at least one second injection hole connected to the second channel are formed in the second electrode to inject another material onto the top surface of the substrate.
3. The vapor deposition reactor of claim 1 , wherein the at least one protrusion comprises a protruding thread formed on an outer surface of the platform extending spirally along a length of the platform.
4. The vapor deposition reactor of claim 1 , wherein the cross-section of the platform is concentrically.
5. The vapor deposition reactor of claim 1 , wherein at least one of the first electrode or the second electrode is formed with at least one channel for conveying cooling water.
6. The vapor deposition reactor of claim 1 , wherein the first channel extends in the longitudinal direction of the platform.
7. The vapor deposition reactor of claim 1 , wherein the platform is a cylinder.
8. The vapor deposition reactor of claim 1 , wherein the substrate is moved relative to the body of the first electrode while the material is injected into the reaction space between the first electrode and the second electrode.
9. The vapor deposition reactor of claim 1 , wherein the materials is a source precursor or a reactant precursor for performing atomic layer deposition (ALD) on the top surface of the substrate.
10. The vapor deposition reactor of claim 1 , wherein the cross-section of the platform is a circle or a semi-circle.
11. The vapor deposition reactor of claim 1 , wherein the reaction space is open towards the top of the substrate, and wherein the second electrode is placed within the reaction space.
12. The vapor deposition reactor of claim 1 , further comprising a power source for applying voltage between the first electrode and the second electrode.
13. The vapor deposition reactor of claim 1 , wherein a height of the second electrode is 10 mm to 100 mm.
14. The vapor deposition reactor of claim 13 , wherein a distance from the bottom of the body of the first electrode to the top surface of the substrate is 0.1 mm to 5 mm.