Image sensor and method for manufacturing the same
View Patent ↗An image sensor and a method of manufacturing an image sensor. An image sensor may include a readout circuitry having a metal line on and/or over a first substrate. An image sensor may include an image sensing part having a first conductive-type conductive layer and/or a second conductive-type conductive layer over a metal line. An image sensor may include a pixel division area formed on and/or over an image sensing part corresponding to a pixel boundary. An image sensor may include a ground contact on and/or over a pixel division area. An image sensor may include a contact plug connected with a sidewall of an image sensing part. A method of manufacturing an image sensor is disclosed.
1. An apparatus comprising:
a readout circuitry including a metal line over a first substrate;
an image sensing part including a first conductive-type conductive layer and a second conductive-type conductive layer over said metal line;
a pixel division area over said image sensing part corresponding to a pixel boundary; and
a ground contact over said pixel division area.
2. The apparatus of claim 1 , wherein said pixel division area comprises an insulating layer over a first trench formed by removing said image sensing part corresponding to said pixel boundary.
3. The apparatus of claim 1 , wherein said ground contact comprises a metal layer over a second trench formed by removing a portion of said pixel division area to expose a lateral side of said second conductive-type conductive layer, wherein said ground contact contacts a lateral side of said second conductive-type conductive layer.
4. The apparatus of claim 1 , comprising a contact plug over a third trench formed by removing a portion of said image sensing part to expose said metal line.
5. The apparatus of claim 4 , wherein said contact plug contacts said first conductive-type conductive layer.
6. An apparatus comprising:
a readout circuitry including a metal line over a first substrate;
an image sensing part including a first conductive-type conductive layer and a second conductive-type conductive layer over said metal line; and
a contact plug connected with a sidewall of said image sensing part.
7. The apparatus claim 6 , wherein said contact plug is connected to at least two sidewalls of said image sensing part.
8. The apparatus of claim 6 , wherein said contact plug is connected to said first conductive-type conductive layer.
9. The apparatus of claim 6 , wherein said metal line comprises a horizontal width wider than a horizontal width of said image sensing part.
10. The apparatus of claim 6 , comprising a ground contact over a pixel division area of said image sensing part.
11. The apparatus of claim 10 , wherein said ground contact contacts a lateral side of said second conductive-type conductive layer.
12. A method comprising:
forming a readout circuitry including a metal line over a first substrate;
forming an image sensing part including a first conductive-type conductive layer and a second conductive-type conductive layer over said metal line; and
forming a contact plug connected to a sidewall of said image sensing part.
13. The method of claim 12 , wherein said contact plug is connected to at least two sidewalls of said image sensing part.
14. The method of claim 12 , wherein said contact plug is connected to said first conductive-type conductive layer.
15. The method of claim 12 , wherein forming said contact plug comprises:
forming a first trench to expose said metal line by removing a portion of a pixel boundary of said image sensing part;
forming a metal layer over said first trench; and
etching a portion of said metal layer to form said contact plug at said sidewall.
16. The method of claim 15 , wherein etching said portion of said metal layer comprises an etch-back process performed with respect to said metal layer such that said contact plug is formed at said sidewall of said image sensing part.
17. The method of claim 12 , wherein said metal line comprises a horizontal width wider than a horizontal width of said image sensing part.
18. The method of claim 12 , comprising forming a ground contact over a pixel division area of said image sensing part.
19. The method of claim 18 , wherein forming said ground contact comprises:
removing a portion of said pixel division area to expose a lateral side of said second conductive-type conductive layer; and
forming said ground contact contacting said lateral side of said second conductive-type conductive layer.
20. The method of claim 18 , wherein forming said ground contact comprises:
forming a second trench by removing a portion of said pixel division area to expose a lateral side of said second conductive-type conductive layer; and
filling a metal layer over said second trench such that said ground contact contacts said lateral side of said second conductive-type conductive layer.