Method of making a circuitized substrate
View Patent ↗A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacitance in the formed circuit while only slightly increasing the high frequency resistance, thereby improving circuit performance through the substantial elimination of some discontinuities known to exist in structures like these. An electrical assembly (substrate and at least one electrical component) is also provided.
1. A method of making a circuitized substrate comprising:
providing a first dielectric layer;
forming a first electrical conductor on said first dielectric layer;
forming an opening within said first electrical conductor;
positioning a quantity of resistor material within said opening within said first electrical conductor;
forming a second dielectric layer substantially over said quantity of resistor material within said opening within, said first electrical conductor;
forming a second electrical conductor on said second dielectric layer; and
passing an electrical connection through said second electrical conductor and said quantity of resistor material, said electrical connection being unconnected, electrically, to said first electrical conductor, to substantially reduce the capacitance between said first and second electrical conductors and increase the high frequency resistance in said electrical connection therebetween.
2. The method of claim 1 wherein said first and second electrical conductors are formed using photolithographic processing.
3. The method of claim 1 wherein said positioning of said quantity of resistor material within said opening within said first electrical conductor is accomplished using screen printing.
4. The method of claim 1 further wherein said quantity of resistor material is deposited in paste form, said method further including substantially curing said resistor material prior to said forming of said second dielectric layer substantially over said first electrical conductor and said quantity of resistor material within said opening within said first electrical conductor.
5. The method of claim 1 further including providing an interim dielectric layer over said first electrical conductor having said opening therein and forming a second opening within said interim dielectric layer aligned over said opening within said first electrical conductor.
6. The method of claim 5 wherein said interim dielectric layer is laminated onto said first electrical conductor and said quantity of resistor material is also positioned within said second opening within said interim dielectric layer.
7. The method of claim 1 wherein said forming of said electrical connection between said second electrical conductor and said first electrical conductor is accomplished by forming a thru-hole through said quantity of resistor material.
8. The method of claim 7 wherein said forming of said giro-hole comprises drilling a hole through said second dielectric layer and thereafter plating a conductive layer on the internal surfaces of said hole.