IP Library Granted Patent US 8,243,405
Granted Patent B2
US 8,243,405 · App. 12/595,378 · Granted Aug 14, 2012

Circuit, integrated circuit and method for dissipating heat from an inductive load

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Quick Facts
Patent No.
US 8,243,405
App. No.
12/595,378
Granted
Aug 14, 2012
Kind
B2
Abstract

A circuit comprises an inductive load. The circuit further comprises an energy-absorbing component operably coupled to the inductive load and arranged to absorb energy generated by the inductive load.

Claims (33)

1. A circuit comprising:

an energy-absorbing component operably coupled to an inductive load and a current drain, the energy-absorbing component is arranged to absorb energy generated by the inductive load, and the energy-absorbing component comprises:

a capacitor having:

a cathode coupled to the current drain; and

an anode coupled to an anode voltage;

a diode operably coupled between the energy-absorbing and the inductive load; and

a switch in series with the diode, the switch configured to coupled the energy-absorbing component to the inductive load;

wherein the capacitor is arranged to store energy generated by the inductive load and the current drain is arranged to remove the stored energy when the anode voltage is greater than a clamp voltage.

2. The circuit of claim 1 wherein an inductive load driver is located in an integrated circuit package and the energy-absorbing component is located external thereto.

3. The circuit of claim 2 wherein the integrated circuit package comprises an internal dissipation circuit.

4. The circuit of claim 1 wherein the anode is coupled to a voltage supply to which the inductive load is coupled or coupled to ground.

5. The circuit of claim 1 wherein the energy-absorbing component is coupled to a clamping voltage source via the current drain.

6. The circuit of claim 5 wherein the energy-absorbing component is further coupled to the clamping voltage source via pre-charging circuitry.

7. The circuit of claim 6 wherein the pre-charging circuitry comprises a diode located in parallel with the current drain.

8. The circuit of claim 1 wherein the clamping voltage is arranged to be lower than a breakdown voltages of an inductive load driver.

9. The circuit of claim 1 wherein the energy-absorbing component is arranged to stored energy released from a plurality of inductive loads.

10. The circuit of claim 9 wherein the plurality of inductive loads are driven by a plurality of inductive load drivers integrated into a single integrated circuit package.

11. The circuit of claim 1 wherein energy stored by the energy-absorbing component is subsequently used for energy regeneration.

12. The circuit of claim 1 wherein the circuit forms a part of an anti-lock brake system (ABS) or electronic stabilisation program (ESP) system.

13. An anti-lock brake system comprising a circuit according to claim 1 .

14. An electronic stabilisation program system comprising a circuit according to claim 1 .

15. A method of dissipating energy from a circuit comprising an inductive load; the method comprising:

routing current from the inductive load to an energy-absorbing component comprising a capacitor having a cathode coupled to a current drain and an anode coupled to an anode voltage arranged to store energy generated by the inductive load;

opening a switch coupled between the inductive load and the energy-absorbing component in response to the capacitor charging to a clamp voltage; and

dissipating energy from the energy-absorbing component through the current drain operatively coupled to the energy-absorbing component when the anode voltage is greater than the clamp voltage.

16. The method of claim 15 comprising storing energy released from a plurality of inductive loads by the energy-absorbing component.

17. The circuit of claim 2 wherein the energy-absorbing component is coupled to the clamping voltage source via the current drain.

18. The circuit of claim 3 wherein the energy-absorbing component is coupled to the clamping voltage source via the current drain.

19. A circuit comprising:

an energy-absorbing component operably coupled to an inductive load and a current drain, the energy-absorbing component is arranged to absorb energy generated by the inductive load, and the energy-absorbing component comprises:

a capacitor having a cathode coupled to the current drain, and an anode coupled to an anode voltage, wherein the capacitor is arranged to store energy generated by the inductive load and the current drain is arranged to remove the stored energy when the anode voltage is greater than a clamp voltage source; and

a diode having an anode coupled to the clamp voltage source, and a cathode coupled to the cathode of the capacitor, the diode located in parallel with the current drain.

20. The circuit of claim 19 wherein an inductive load driver is located in an integrated circuit package and the energy-absorbing component is located external to the integrated circuit package.

Assignments (28)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENTS 8143405 AND 8143855 PREVIOUSLY RECORDED ON REEL 037518 FRAME 292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Sep 12, 2018
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBERS 8143405 AND 8143855 PREVIOUSLY RECORDED ON REEL 041703 FRAME 536. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Sep 12, 2018
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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