ESD protection device and method of forming an ESD protection device
View Patent ↗An ESD protection device, which is arranged to be active at a triggering voltage (Vt 1 ) for providing ESD protection, comprises a first region of the first conductivity type formed in a semiconductor layer of the first conductivity type, the first region extending from a surface of the semiconductor layer and being coupled to a first current electrode (C) of the semiconductor device, a well region of a second conductivity type formed in the semiconductor layer extending from the surface of the semiconductor layer, and a second region of the second conductivity type formed in the well region, the second region being coupled to a second current electrode (B). The ESD protection device further comprises a floating region of the second conductivity type formed in the semiconductor layer between the first current electrode (C) and the well region and extending from the surface of the semiconductor layer a predetermined depth. The floating region is separated from the well region by a predetermined distance, a value of which is selected such that the floating region is located within a depletion region of a PN junction between the well region and the semiconductor layer when the ESD protection device is active. The floating region has a doping concentration selected such that the floating region is not fully depleted when the ESD protection device is active and the predetermined depth is selected such that the floating region modifies a space charge region near the PN junction. An ESD protection device according to a second embodiment is also disclosed.
1. An ESD protection device arranged to be active at a triggering voltage (Vtl) for providing ESD protection, the ESD protection device comprising:
a semiconductor layer of a first conductivity type;
a first region of the first conductivity type formed in the semiconductor layer, the first region extending from a surface of the semiconductor layer;
a well region of a second conductivity type formed in the semiconductor layer extending from the surface of the semiconductor layer;
a second region of the second conductivity type formed in the well region, the second region being coupled to a second current electrode (B) of the semiconductor device;
a third region of the first conductivity type formed in the well region, the third region being coupled to a third current electrode (E) of the semiconductor device;
a fourth region of the first conductivity type formed in the first region, the fourth region being coupled to a first current electrode de (C) of the semiconductor device; and
a floating region of the second conductivity type formed in the semiconductor layer between the first current electrode (C) and the well region and extending from the surface of the semiconductor layer a predetermined depth, the floating region being separated from the well region by a predetermined distance, a value of the predetermined distance causes the floating region to be located within a depletion region of a PN junction between the well region and the semiconductor layer when the ESD protection device is active,
wherein the floating region has a doping concentration greater than 10 17 cm −3 and the doping concentration causes the floating region to not be fully depleted when the ESD protection device is active and wherein the predetermined depth is such that the floating region modifies a space charge region near the PN junction.
2. The ESD protection device according to claim 1 , wherein the well region extends into the semiconductor layer a first depth from the surface and wherein the predetermined depth is substantially the same as the first depth.
3. The ESD protection device according to claim 1 , further comprising a well region of the first conductivity type formed in the semiconductor layer and extending from the surface so as to surround the first region, wherein the semiconductor layer has a first doping concentration and the well region has a second doping concentration, the first doping concentration being less than the second doping concentration.
4. The ESD protection device according to claim 3 , wherein the well region extends into the semiconductor layer a first depth from the surface and wherein the predetermined depth is substantially the same as the first depth.
5. The ESD protection device according to claim 1 , wherein the ESD protection device exhibits a soft snap back based on the predetermined distance.
6. The ESD protection device according to claim 5 , wherein the soft snap back is a small difference between the triggering voltage of the ESD protection device and a holding voltage of the ESD protection device.
7. The ESD protection device according to claim 2 , wherein the ESD protection device to exhibit a soft snap back based on the predetermined distance.
8. The ESD protection device according to claim 7 , wherein the soft snap back is a small difference between the triggering voltage of the ESD protection device and a holding voltage of the ESD protection device.
9. An ESD protection device arranged to be active at a triggering voltage (Vt 1 ) for providing ESD protection, the ESD protection device comprising:
a semiconductor layer of a second conductivity type;
a well region of a first conductivity type formed in the semiconductor layer extending from a surface of the semiconductor layer, the well region being coupled to a first current electrode (C) of the semiconductor device;
a second region of the second conductivity type formed in the semiconductor layer, the second region being coupled to a second current electrode (B) region of the semiconductor device;
a third region of the first conductivity type extending from the surface of the semiconductor layer
a fourth region of the first conductivity type formed in the third region, the fourth region being coupled to a third current electrode (E); and
a floating region of the first conductivity type formed in the semiconductor layer between the well region and the third current electrode (E) and extending from the surface of the semiconductor layer a predetermined depth, the floating region being separated from the well region by a predetermined distance, a value of the predetermined distance causes the floating region to be located within a depletion region of a PN junction between the well region and the semiconductor layer when the ESD protection device is active,
wherein the floating region has a doping concentration greater than 10 17 cm −3 , and the doping concentration causes the floating region to not be fully depleted when the ESD protection device is active and wherein the predetermined depth is such that the floating region modifies a space charge region near the PN junction.
10. The ESD protection device according to claim 9 , wherein the well region extends into the semiconductor layer a first depth from the surface and wherein the predetermined depth is substantially the same as the first depth.
11. The ESD protection device according to claim 9 , further comprising a well region of the second conductivity type formed in the semiconductor layer and extending from the surface so as to surround the second and third regions, wherein the semiconductor layer has a first doping concentration and the well region has a second doping concentration, the first doping concentration being less than the second doping concentration.
12. The ESD protection device according to claim 11 , wherein the well region extends into the semiconductor layer a first depth from the surface and wherein the predetermined depth is substantially the same as the first depth.
13. The ESD protection device according to claim 9 , wherein the ESD protection device to exhibit a soft snap back based on the predetermined distance.
14. The ESD protection device according to claim 13 , wherein the soft snap back is a small difference between the triggering voltage of the ESD protection device and a holding voltage of the ESD protection device.
15. The ESD protection device according to claim 10 , wherein the ESD protection device to exhibit a soft snap back based on the predetermined distance.
16. The ESD protection device according to claim 15 , wherein the soft snap back is a small difference between the triggering voltage of the ESD protection device and a holding voltage of the ESD protection device.
17. A method of forming an electrostatic discharge (ESD) protection device arranged to be active at a triggering voltage for providing ESD protection, the method comprising:
providing a semiconductor layer of a first conductivity type;
forming a first region of the first conductivity type in the semiconductor layer, the first region extending from a surface of the semiconductor layer;
forming a well region of a second conductivity type in the semiconductor layer extending from the surface of the semiconductor layer;
forming a second region of the second conductivity type in the well region, the second region abutting a second current electrode of the semiconductor device;
forming a third region of the first conductivity type in the well region, the third region abutting a third current electrode of the semiconductor device;
forming a fourth region of the first conductivity type formed in the first region, the fourth region abutting a first current electrode of the semiconductor device; and
forming a floating region of the second conductivity type in the semiconductor layer between the first current electrode and the well region, wherein
the floating region extends from the surface of the semiconductor layer a predetermined depth;
the floating region is a predetermined distance from the well region;
the floating region is located within a depletion region of a PN junction, and between the well region and the semiconductor layer when the ESD protection device is active based on a value of the predetermined distance, wherein the ESD protection device exhibits a soft snap back based on the predetermined distance; and
the floating region has a doping concentration greater than 10 17 cm −3 , the doping concentration causing the floating region to not be fully depleted when the ESD protection device is active and wherein the predetermined depth is such that the floating region modifies a space charge region near the PN junction.
18. The method of claim 17 , wherein the soft snap back is a small difference between the triggering voltage of the ESD protection device and a holding voltage of the ESD protection device.
19. The method of claim 17 , wherein the well region extends into the semiconductor layer a first depth from the surface and wherein the predetermined depth is substantially the same as the first depth.
20. The method of claim 17 , further comprising:
forming a well region of the second conductivity type in the semiconductor layer; and
extending the well region of the second conductivity type from the surface so as to surround the second and third regions, wherein the semiconductor layer has a first doping concentration and the well region has a second doping concentration, the first doping concentration being less than the second doping concentration.