Integrated circuit encapsulation and method therefor
View Patent ↗A device ( 12 ) may have a pressure sensitive portion ( 17 ) which is protected from corrosion by a pressure transmitting material ( 20 ). Pressure transmitting material ( 20 ) may also be used to transmit pressure to pressure sensitive portion ( 17 ). A masking material ( 22 ) may be used to define an opening ( 26 ) in encapsulating material ( 24 ).
1. A packaged integrated circuit, comprising:
a package having a cavity;
an integrated circuit placed in the cavity, said integrated circuit having a pressure sensitive portion;
a pressure transmitting layer overlying the pressure sensitive portion of the integrated circuit,
a sacrificial layer formed overlying a first portion of the pressure transmitting layer;
an encapsulating material formed overlying a second portion of the pressure transmitting layer,
wherein the sacrificial layer defines an opening to the pressure transmitting layer which overlies the pressure sensitive portion of the integrated circuit, and
wherein the pressure transmitting layer transmits pressure to the pressure sensitive portion of the integrated circuit while protecting the pressure sensitive portion of the integrated circuit.
2. The packaged integrated circuit of claim 1 , wherein the sacrificial layer is removed to form the opening to the pressure transmitting layer.
3. The packaged integrated circuit of claim 1 , wherein the integrated circuit comprises a pressure sensor.
4. The packaged integrated circuit of claim 1 , wherein the pressure transmitting layer comprises a gel.
5. The packaged integrated circuit of claim 4 , wherein the gel is flexible.
6. The packaged integrated circuit of claim 4 , wherein the gel is rigid.
7. The packaged integrated circuit of claim 1 , wherein the integrated circuit is attached to the package using an adhesive.
8. The packaged integrated circuit of claim 1 further comprising a cap overlying the encapsulating material, wherein the cap comprises a material selected from a group consisting of steel and plastic.
9. The packaged integrated circuit of claim 1 , wherein the opening to the pressure transmitting layer is formed by:
applying the sacrificial layer overlying at least a portion of the pressure transmitting layer;
applying the encapsulating material to encapsulate the integrated circuit and the pressure transmitting layer, while leaving a portion of the sacrificial layer unecapsulated; and
removing at least a portion of the sacrificial layer to expose the pressure transmitting layer.
10. A packaged pressure sensor, comprising:
a package having a cavity;
a pressure sensor placed in the cavity, said pressure sensor having a pressure sensitive portion;
a gel layer overlying the pressure sensitive portion of the pressure sensor,
a sacrificial layer formed overlying a first portion of the gel layer; and
an encapsulating material formed overlying a second portion of the gel layer,
wherein the sacrificial layer defines an opening to the gel layer which overlies the pressure sensitive portion of the pressure sensor, and wherein the gel layer transmits pressure to the pressure sensitive portion of the pressure sensor while protecting the pressure sensitive portion of the pressure sensor.
11. The packaged pressure sensor of claim 10 , wherein the sacrificial layer is removed to form the opening to the gel layer.
12. The packaged pressure sensor of claim 11 , wherein the gel layer is flexible.
13. The packaged pressure sensor of claim 11 , wherein the gel layer is rigid.
14. The packaged pressure sensor of claim 10 , wherein the pressure sensor is attached to the package using an adhesive.
15. The packaged pressure sensor of claim 10 further comprising a cap overlying the encapsulating material, wherein the cap comprises a material selected from a group consisting of steel and plastic.
16. The packaged pressure sensor of claim 10 , wherein the opening to the gel layer is formed by:
applying the sacrificial layer overlying at least a portion of the gel layer;
applying the encapsulating material to encapsulate the pressure sensor and the gel layer, while leaving a portion of the sacrificial layer unecapsulated; and
removing at least a portion of the sacrificial layer to expose the gel layer.
17. A packaged pressure sensor, comprising:
a package having a cavity;
a pressure sensor placed in the cavity, said pressure sensor having a pressure sensitive portion;
a gel layer overlying the pressure sensitive portion of the pressure sensor,
a sacrificial layer formed overlying a first portion of the gel layer; and
an encapsulating material formed overlying a second portion of the gel layer, wherein the sacrificial layer defines an opening to the gel layer which overlies the pressure sensitive portion of the pressure sensor, and wherein the gel layer transmits pressure to the pressure sensitive portion of the pressure sensor while protecting the pressure sensitive portion of the pressure sensor, and wherein the opening to the gel layer is formed by:
applying a sacrificial layer overlying at least a portion of the gel layer,
applying the encapsulating material to encapsulate the pressure sensor and the gel layer, while leaving a portion of the sacrificial layer unecapsulated, and
removing at least a portion of the sacrificial layer to expose the gel layer, and wherein removing the sacrificial layer comprises rinsing the sacrificial layer in water.
18. The packaged pressure sensor of claim 17 , wherein the sacrificial layer is removed to form the opening to the gel layer.
19. The packaged pressure sensor of claim 17 , wherein the gel layer is flexible.
20. The packaged pressure sensor of claim 17 , wherein the gel layer is rigid.