A memory includes conductive layers provided to extend along the word lines, memory cells each including a diode having a cathode connected to the conductive layer and a source line reading data stored in the memory cells, wherein either the conductive layers or the bit lines are in floating states in a standby time.
1. A memory comprising:
a plurality of word lines;
a plurality of bit lines arranged to intersect with said plurality of word lines;
conductive layers provided to extend along said word lines;
memory cells arranged on positions where said conductive layers and said bit lines intersect with each other and each including a diode having a cathode connected to said conductive layer; and
a source line reading data stored in said memory cells, wherein
either said conductive layers or said bit lines are in floating states in a standby time.
2. The memory according to claim 1 , further comprising:
a column decoder connected to said plurality of bit lines; and
a first transistor provided between ends of said bit lines on a side connected to said column decoder and a ground potential, wherein
said first transistor enters an OFF-state in the standby time, thereby bringing said bit lines into said floating states.
3. The memory according to claim 2 , wherein
said first transistor enters the OFF-state on a basis of a chip enable signal in the standby time.
4. The memory according to claim 2 , further comprising inverter circuits provided between said first transistor and said bit lines and having output terminals connected to said bit lines, wherein
a first source/drain region of said first transistor is connected to terminals, supplying low potentials, of said inverter circuits, and a second source/drain region of said first transistor is connected to said ground potential.
5. The memory according to claim 2 , wherein said first transistor is provided for said plurality of bit lines.
6. The memory according to claim 1 , further comprising a second transistor provided between said conductive layers and a potential on a high voltage side supplied to said source line, wherein
said second transistor enters an OFF-state in the standby time, thereby bringing said conductive layers into said floating states.
7. The memory according to claim 6 , wherein
said second transistor enters the OFF-state in the standby time on a basis of a signal reaching a high level in a precharge time.
8. The memory according to claim 7 , further comprising a logic circuit connected to a gate electrode of said second transistor, wherein
said signal reaching the high level in the precharge time and an inverted signal of a chip enable signal reaching a low level in the standby time are connected to an input side of said logic circuit, and said logic circuit outputs a signal having a high level in the standby time.
9. The memory according to claim 6 , wherein
said source line includes a plurality of source lines connected to respective groups each consisting of a prescribed number of word lines, and
said second transistors are provided one by one for said plurality of source lines, respectively.
10. The memory according to claim 9 , wherein
said second transistors provided one by one for said plurality of source lines respectively simultaneously enter the OFF-states in the standby time on a basis of said signal reaching the high level in the precharge time.
11. The memory according to claim 1 , wherein
said memory cells are each constituted by said diode.
12. The memory according to claim 1 , further comprising selection transistors provided between said conductive layers and said source line, wherein
said conductive layers are connected to first source/drain regions of said selection transistors and said source line is connected to second source/drain regions of said selection transistors.
13. A memory comprising:
a plurality of word lines,
a plurality of bit lines arranged to intersect with said plurality of word lines,
conductive layers provided to extend along said word lines,
memory cells arranged on positions where said conductive layers and said bit lines intersect with each other and each including a diode having a cathode connected to said conductive layer,
a source line reading data stored in said memory cells, and
transistors having first source/drain regions connected to said bit lines and second source/drain regions connected to a prescribed potential and entering ON-states when conducting a test for evaluating a leak phenomenon in a standby time.
14. The memory according to claim 13 , wherein
said transistors enter the ON-states in the standby time in said test for evaluating the leak phenomenon in the standby time.
15. The memory according to claim 13 , wherein
said leak phenomenon in said standby time that leak currents flow from cathodes of said diodes to anodes is intentionally produced by bring said transistors into the ON-states to supply said prescribed potential to said bit lines.
16. The memory according to claim 13 , wherein
said transistors enter the ON-states on a basis of a start signal of said test for evaluating the leak phenomenon in the standby time.
17. The memory according to claim 16 , further
comprising a logic circuit connected to gate electrodes of said transistors, wherein
said start signal of said test for evaluating the leak phenomenon in the standby time and either a chip enable signal or an inverted signal of the chip enable signal are connected to an input side of said logic circuit.
18. The memory according to claim 13 , wherein
said prescribed potential is a potential on a high voltage side.
19. The memory according to claim 13 , wherein
said transistors are provided one by one for said plurality of bit lines, respectively.
20. The memory according to claim 13 , further comprising a column decoder connected to said plurality of bit lines, wherein
said transistors are connected to ends of said bit lines on a side opposite to a side connected to said column decoder.