Granted Patent B2

US 8,062,424 · App. 12/617,734 · Granted Nov 22, 2011

Abstract

Claims (19)

1. An apparatus for encapsulating a semiconductor die attached to a substrate, the apparatus comprising:

a container for holding an encapsulation material;

a vacuum pump operably connected to the container for creating a vacuum state within the container;

a heater for heating the encapsulation material in the container to a liquid state;

an agitator for agitating the encapsulation material in the container;

a dispense opening in the container through which the liquid encapsulation material is dispensed onto the semiconductor die; and

a guide connected to the container that guides the liquid encapsulation material dispensed from the dispense opening to the substrate, wherein the guide includes a sloped member having a sloped surface along which the liquid encapsulation material flows.

2. The encapsulation apparatus of claim 1 , wherein the guide is movable between a first position in which liquid encapsulation material may be dispensed from the container and a second position in which the guide blocks the dispense opening and stops dispensing of the liquid encapsulation material.

3. The encapsulation apparatus of claim 1 , further comprising a cooling device arranged near the dispense opening which cools the liquid encapsulation material dispensed from the dispense opening.

4. The encapsulation apparatus of claim 1 , further comprising a lid that covers and seals the container.

5. A dispenser head for an encapsulation apparatus for covering a semiconductor die attached to a substrate with a polymer sealant, the apparatus comprising:

a container for holding the polymer sealant, wherein the polymer sealant is placed into the container in a solid state;

a lid for sealing the container;

a vacuum pump operably connected to the container for creating a vacuum state within the container;

a heater for heating and melting the polymer sealant in the container to a liquid state;

a nozzle in the container through which the liquid polymer sealant may exit the container;

an agitator inside the container for agitating the liquid polymer sealant;

a guide disposed below the nozzle for receiving the liquid polymer sealant and guiding the liquid polymer sealant over the semiconductor die; and

a cooling device located near the guide for cooling the liquid polymer sealant from a liquid state to a gel-like state after the liquid polymer sealant exits the container by way of the nozzle.

Assignments (27)