Devices with crack stops
View Patent ↗An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.
1. An apparatus comprising:
a device on a substrate; and
at least one crack stop in the substrate, wherein the at least one crack stop is aligned in a circular pattern along the perimeter of the substrate.
2. The apparatus of claim 1 , wherein the at least one crack stop comprises multiple crack stops aligned in one or more rows around the device.
3. The apparatus of claim 1 , further comprising at least two devices on the substrate.
4. The apparatus of claim 1 , wherein the device is on a first surface of the substrate and the at least one crack stop extends from a second surface of the substrate towards the first surface of the substrate.
5. The apparatus of claim 1 , wherein the at least one crack stop comprises a hole in the substrate.
6. The apparatus of claim 1 , wherein the at least one crack stop comprises a trench in the substrate.
7. The apparatus of claim 1 , wherein the device and the at least one crack stop are separate from each other on a flexible material such as a tape.
8. The apparatus of claim 1 , wherein the substrate comprises a thinned substrate.
9. The apparatus of claim 3 , further comprising an additional crack stop located between the at least two devices.
10. The apparatus of claim 4 , wherein the at least one crack stop extends completely through the substrate.
11. The apparatus of claim 5 , wherein a cross-sectional diameter of the hole is between 1-100μm.
12. The apparatus of claim 5 , wherein a cross-sectional shape of the hole is a circle, oval, elongated oval, crescent, or other shape with rounded edges.
13. The apparatus of claim 9 , wherein the additional crack stop comprises a trench in the substrate and extends between the at least two devices.
14. A substrate that includes a crack stop;
a device on the substrate; and
the crack stop is separate from the device and extends completely through the substrate.
15. The substrate of claim 14 , wherein the crack stop comprises a polycrystalline material.
16. The substrate of claim 14 , wherein the substrate comprises a thinned substrate.
17. The substrate of claim 14 , wherein the crack stop is located along the perimeter of the substrate.
18. The substrate of claim 14 , wherein the crack stop comprises multiple crack stops aligned in one or more rows around the device.
19. The substrate of claim 14 , further comprising at least two devices on the substrate.
20. The substrate of claim 19 , wherein the crack stop is located between the at least two devices.
21. The substrate of claim 20 , wherein the crack stop comprises an additional crack stop located along the perimeter of the substrate.